Wetzlar
Germany
28
2007-04-24
22
2007-04-24
These are the the leading inventors for applications assigned to Leica Microsystems Semiconductor GmbH:
Leica Microsystems Semiconductor GmbH based in Wetzlar, DE has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Illumination device, and coordinate measuring instrument having an illumination device
#2 | 2007-02-20 β Patent 7,180,585 granted on 2007-02-20Apparatus for wafer inspection
#3 | 2006-12-26 β Patent 7,152,488 granted on 2006-12-26System operating unit
#4 | 2006-09-14 β Patent 7,657,077 granted on 2010-02-02Detecting defects by three-way die-to-die comparison with false majority determination
#5 | 2006-08-17 β Patent 7,277,160 granted on 2007-10-02Method for automatically providing data for the focus monitoring of a lithographic process
#6 | 2006-08-10 β Patent 7,417,719 granted on 2008-08-26Method, device and software for the optical inspection of a semi-conductor substrate
#7 | 2006-07-25 β Patent 7,081,963 granted on 2006-07-25Substrate holder, and use of the substrate holder in a highly accurate measuring instrument
#8 | 2006-05-23 β Patent 7,050,223 granted on 2006-05-23DUV-capable microscope objective with parfocal IR focus
#9 | 2006-05-18Method for inspecting a wafer
#10 | 2006-05-11Adapter apparatus for a substrate workstation
#11 | 2006-03-28 β Patent 7,019,910 granted on 2006-03-28Inspection microscope and objective for an inspection microscope
#12 | 2006-02-28 β Patent 7,005,638 granted on 2006-02-28Apparatus and method for reducing the electron-beam-induced deposition of contamination products
#13 | 2005-12-22Method and system for inspecting a wafer
#14 | 2005-12-22Method and system for inspecting a wafer
#15 | 2005-12-13 β Patent 6,975,409 granted on 2005-12-13Illumination device; and coordinate measuring instrument having an illumination device
#16 | 2005-11-17 β Patent 7,420,670 granted on 2008-09-02Measuring instrument and method for operating a measuring instrument for optical inspection of an object
#17 | 2005-11-01 β Patent 6,960,755 granted on 2005-11-01Contact sensor, and apparatus for protecting a protruding component
#18 | 2005-10-13Apparatus and method for the determination of positioning coordinates for semiconductor substrates
#19 | 2005-10-06 β Patent 7,268,867 granted on 2007-09-11Apparatus and method for inspecting a semiconductor component
#20 | 2005-09-13 β Patent 6,943,901 granted on 2005-09-13Critical dimension measuring instrument
#21 | 2005-08-04 β Patent 7,460,219 granted on 2008-12-02Method for optically inspecting a wafer by sequentially illuminating with bright and dark field light beams wherein the images from the bright and dark field illuminated regions are spatially offset
#22 | 2005-08-02 β Patent 6,924,900 granted on 2005-08-02Method and microscope for detection of a specimen
#23 | 2005-07-19 β Patent 6,919,658 granted on 2005-07-19Coordinate measuring stage
#24 | 2005-07-19 β Patent 6,920,249 granted on 2005-07-19Method and measuring instrument for determining the position of an edge of a pattern element on a substrate
#25 | 2005-06-09Apparatus for wafer inspection
#26 | 2005-04-21 β Patent 7,375,792 granted on 2008-05-20Apparatus for measuring feature widths on masks for the semiconductor industry
#27 | 2005-04-12 β Patent 6,879,440 granted on 2005-04-12Autofocus module and method for a microscope-based system
#28 | 2005-01-06 β Patent 7,193,699 granted on 2007-03-20Method and apparatus for scanning a semiconductor wafer
291714 β