B81C2201/0163 - CPC Classification Index

ClassID:

84107 ⎘

B81C2201/0163 - CPC Classification

Classification description:

Manufacture or treatment of microstructural devices or systems in or on a substrate; Controlling physical properties of the material Controlling internal stress of deposited layers

Sub-classes:

B81C2201/0164 » by doping the layer 7
B81C2201/0166 » by ion implantation 6
B81C2201/0167 » by adding further layers of materials having complementary strains, i.e. compressive or tensile strain 110
B81C2201/0169 » by post-annealing 24
B81C2201/017 » Methods for controlling internal stress of deposited layers not provided for in to 97

Recent Application in this class:

20230303387

2023-09-28

MECHANICALLY COUPLED PIEZOELECTRIC MEMS MICROPHONE

20220185656

2022-06-16

Manufacturing method of semiconductor structure

20210236700

2021-08-05

TUNING ADHESION AT CONTACTING DEVICE INTERFACES: GEOMETRIC TOOLS FOR MINIMIZING SURFACE FOULING

20200361763

2020-11-19

Manufacturing method of semiconductor structure

20190366492

2019-12-05

Method of manufacturing a remote-controlled micro-scale three-dimensional self-assembly

20190189445

2019-06-20

Manufacturing methods to apply stress engineering to self-aligned multi-patterning (SAMP) processes