METAL-CERAMIC SUBSTRATE WITH CONTACT AREA

COPPER-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

METAL-CERAMIC SUBSTRATE HAVING DOUBLE BRAZING LAYERS AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PROCESSING EQUIPMENT WITH HIGH TEMPERATURE RESISTANT NICKEL ALLOY JOINTS AND METHODS FOR MAKING SAME

COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING SAME

METAL-CERAMIC SUBSTRATE, METHOD FOR THE PRODUCTION THEREOF, AND MODULE

JOINED BODY, HOLDING DEVICE, AND ELECTROSTATIC CHUCK

Electrochemical energy storage devices

Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making same

High optical power light conversion device using a phosphor element with solder attachment

Support substrate and method for producing a support substrate

Process for Producing a Metal-Ceramic Substrate, and a Metal-Ceramic Substrate Produced Using Such Method

COPPER-GRAPHENE BONDED BODY AND METHOD FOR MANUFACTURING SAME, AND COPPER-GRAPHENE BONDED STRUCTURE

Method for producing a metal-ceramic substrate with electrically conductive vias

METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE AND FURNACE

Copper/ceramic joined body and insulating circuit substrate

Ceramic materials and seals for high temperature reactive material devices

Copper/ceramic joined body, insulating circuit substrate, copper/ceramic joined body production method, and insulating circuit substrate production method

High optical power light conversion device using a phosphor element with solder attachment

Bonded substrate and manufacturing method of bonded substrate

Ceramic-copper composite, method of producing ceramic-copper composite, ceramic circuit board, and power module

BONDED SUBSTRATE

Cover lid with selective and edge metallization and methods of making

Metal-ceramic substrate and method for producing a metal-ceramic substrate

CERAMIC MATERIAL, METHOD OF PRODUCTION, LAYER AND LAYER SYSTEM

POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, METHOD OF PRODUCING POWER MODULE SUBSTRATE, PASTE FOR COPPER SHEET BONDING, AND METHOD OF PRODUCING BONDED BODY

Ceramic materials and seals for high temperature reactive material devices

High optical power light conversion device using a phosphor element with solder attachment

Laser cutting of metal-ceramic substrates

Method for producing a metal-ceramic substrate with at least one via

Ceramic circuit board, method for manufacturing ceramic circuit board, and module using ceramic circuit board

Ceramic-metal substrate with low amorphous phase

Method of manufacturing a singulated feedthrough insulator for a hermetic seal of an active implantable medical device incorporating a post conductive paste filled pressing step

Ceramic Wavelength Converter Having a High Reflectivity Reflector

Bond protection around porous plugs

Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making same

POLYCRYSTALLINE DIAMOND

Brazed joint and semiconductor processing chamber component having the same

Power module substrate

Ceramic circuit substrate and method for producing ceramic circuit substrate

Ceramic circuit board and semiconductor module

Copper-ceramic bonded body and insulation circuit substrate

System and Method for Producing Chemicals at High Temperature

Gallium nitride sintered body or gallium nitride molded article, and method for producing same

COMPOSITION AND METHOD OF PRODUCING BONDED BODY

Bonded body, power module substrate, method for manufacturing bonded body, and method for manufacturing power module substrate

METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE WITH PICOLASER

Metal-ceramic base material, metal-ceramic joint structure, method for producing metal-ceramic joint structure, and mixed powder material

BRAZE COMPOSITIONS, AND RELATED DEVICES

Turbine component assembly

Ceramic member

Method for joining silicon carbide components to one another

Method of bonding a metallic component to a non-metallic component using a compliant material

Producing metal/ceramic circuit board by removing residual silver

Manufactured article and method

Cutting elements with impact resistant diamond body

Method for producing a composite material

Ceramic metal circuit board and semiconductor device using the same

CUTTING TOOL INSERT

Method for producing a metal-ceramic substrate

Ceramic materials and seals for high temperature reactive material devices

Gold wetting on ceramic surfaces upon coating with titanium hydride

Method for manufacturing substrate for power module with heat sink

Method for producing a metal-ceramic substrate with at least one via

Silicon nitride circuit board and semiconductor module using the same

Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink

SUPERHARD CONSTRUCTIONS AND METHODS OF MAKING SAME

Ceramic milling cutter

Method of Joining Metal-Ceramic Substrates to Metal Bodies

High thermal conductive silicon nitride sintered body, and silicon nitride substrate and silicon nitride circuit board and semiconductor apparatus using the same

METHOD FOR OBTAINING A CONFIGURATION FOR JOINING A CERAMIC MATERIAL TO A METALLIC STRUCTURE

Bonded substrate and method for manufacturing bonded substrate

Joined body and method for producing joined body

Cover lid with selective and edge metallization

PRODUCING METHOD OF POWER-MODULE SUBSTRATE

Directly integrated feedthrough to implantable medical device housing

Ceramic circuit board and method for producing same

Method for joining dissimilar engine components

Metal-on-ceramic substrates

Cubic boron nitride sintered body cutting tool

High optical power light conversion device using a phosphor element with solder attachment

CERAMIC THERMAL BARRIER COATING SYSTEM COMPRISING A LAYER PROTECTING AGAINST CMAS

Bonded body, power module substrate, power module and method for producing bonded body

Power-module substrate unit and power module

Process for producing bonded body and process for producing power module substrate

High speed, efficient SiC power module

Pressure sensor having a ceramic platform

Joined body including ceramic member and metallic member and method for manufacturing joined body

Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste

SEALS FOR HIGH TEMPERATURE REACTIVE MATERIAL DEVICES

Method of bonding a metallic component to a non-metallic component using a compliant material

Process for producing a target formed of a sintering-resistant material of a high-melting point metal alloy, silicide, carbide, nitride or boride

Cutting insert, cutting tool comprising such an insert and methods for producing and repairing such a tool

Joined body manufacturing method

Ceramic circuit board

Joined body manufacturing method and joined body

Copper-ceramic bonded body and power module substrate

Ceramic wavelength converter having a high reflectivity reflector

Thermally stable polycrystalline diamond with enhanced attachment joint

Method for producing a metal-ceramic substrate

3D infiltration method

Method for fabricating silicon carbide assemblies

Joined body, honeycomb structure, method for producing joined body, and covered body

Converter-cooling element assembly with metallic solder connection

Nonmetallic airfoil with a compliant attachment

Cu/ceramic bonded body, method for manufacturing Cu/ceramic bonded body, and power module substrate

Surface-coated boron nitride sintered body tool

Method for producing ceramic circuit board

Gas turbine engine CMC airfoil assembly

Method of manufacturing a ceramic metallization for ceramic metal transition

Oxide sintered body and sputtering target, and method for producing same

Method to join dissimilar materials by the cold spray process

Precipitation hardened partial transient liquid phase bond

Li-containing oxide target assembly

Apparatus and method for producing (metal plate)-(ceramic board) laminated assembly, and apparatus and method for producing power-module substrate

Joined body and method for producing the same

Method for manufacturing power module substrate

Method for manufacturing bonded body and method for manufacturing power-module substrate

Sample holder

Joined body and method for producing the same

Manufacturing method of power-module substrate

(Ga) Zn Sn oxide sputtering target

Method for joining ceramic to metal, and sealing structure thereof

Power-module substrate and manufacturing method thereof

Manufacturing method of power-module substrate

Metal/ceramic bonding substrate and method for producing same

System and method for producing chemicals at high temperature

Semiconductor circuit board, semiconductor device using the same, and method for manufacturing semiconductor circuit board

Semiconductor device and ceramic circuit substrate, and producing method of semiconductor device

NbO2 sintered compact, sputtering target comprising the sintered compact, and method of producing NbO2 sintered compact

Modification of diamond feeds for improving polycrystalline diamond cutter

Metal-ceramic substrate and method for producing a metal-ceramic substrate

Ceramic circuit substrate and its production method

Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste

Direct integration of feedthrough to implantable medical device housing by sintering

Cutting tool made of cubic boron nitride-based sintered material

Method for applying heat resistant protection components onto a surface of a heat exposed component

Electrostatic chuck and showerhead with enhanced thermal properties and methods of making thereof

Power module substrate with heat sink, and method for producing power module substrate with heat sink

Ceramic circuit board and electronic device

Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate

Power module substrate, power module substrate with heat sink, and power module

Bonded body and semiconductor module

Cutting tool made of cubic boron nitride-based sintered material

Method for attaching a pre-sintered body of polycrystalline diamond material to a substrate

Soldering method and method of manufacturing semiconductor device

Sealing assembly, method for preparing sealing assembly, and battery comprising the sealing assembly

High temperature electrochemical cell structures, and methods for making

Metal-ceramic substrate

Method for producing a high-voltage electrical insulator with a mortar including a superplasticizer

Process for producing a high-temperature-resistant composite body

Zinc oxide sputtering target and method for producing same

Method for obtaining a configuration for joining a ceramic material to a metallic structure

Ceramic/copper circuit board and semiconductor device

Method for producing bonded body

Joint material, and jointed body

Metal-ceramic joined body

Layered deposition for reactive joining of composites

Method for manufacturing a metal-ceramic composite structure and metal-ceramic composite structure

Cutter structures, inserts comprising same and method for making same

Apparatus and method to reduce wear and friction between CMC-to-metal attachment and interface

Silicon nitride substrate and method for producing silicon nitride substrate

Polycrystalline diamond compacts including at least one transition layer and methods for stress management in polycrystalline diamond compacts

Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate

Seal between metal and ceramic conduits

Brazing material, brazing material paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor module

Active braze techniques on beta-alumina

METHODS OF USING ACTIVE BRAZE TECHNIQUES FOR MAKING HIGH TEMPERATURE RECHARGEABLE BATTERIES

Infiltration compositions for PCD by using coated carbide substrates

Substrate for power module, substrate with heat sink for power module, power module, method for producing substrate for power module, and method for producing substrate with heat sink for power module

BRAZE COMPOSITIONS, AND RELATED DEVICES

Braze compositions, and related devices

METALLIC COMPOSITIONS USEFUL FOR BRAZING, AND RELATED PROCESSES AND DEVICES

SUPER-ABRASIVE MATERIAL WITH ENHANCED ATTACHMENT REGION AND METHODS FOR FORMATION AND USE THEREOF

Manufacture of thermally stable cutting elements

Gallium nitride sintered body or gallium nitride molded article, and method for producing same

Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrate

BRAZE COMPOSITIONS, AND RELATED ARTICLES AND METHODS

Zinc oxide sintered compact, sputtering target, and zinc oxide thin film

Method of manufacturing ceramic sintered body, ceramic sintered body, and ceramic heater

Method for Selective Metallization on a Ceramic Substrate

Polycrystalline diamond compacts and related products

Connection between a shaft and a hub component and method of preparing the connection

Coated CBN sintered body

Composite Material

BRAZED COATED DIAMOND-CONTAINING MATERIALS

Method for producing substrate for power module with heat sink, substrate for power module with heat sink, and power module

SPUTTERING TARGET-BACKING PLATE ASSEMBLY

Joining of parts via magnetic heating of metal aluminum powders

Transparent conductive film

In-Ga-Sn oxide sinter, target, oxide semiconductor film, and semiconductor element

Ceramic metal composite for orthopaedic implants

Method of joining metal-ceramic substrates to metal bodies

Silicon nitride substrate, circuit substrate and electronic device using the same

Ceramic sheet product for ceramic electronic component, multilayer ceramic electronic component using the same and method of manufacturing multilayer ceramic electronic component

Method of manufacturing power module substrate and power module substrate

Polycrystalline diamond compacts including at least one transition layer and methods for stress management in polycrsystalline diamond compacts

BORON SUBOXIDE COMPOSITE MATERIAL

CONSTRAINED METAL FLANGES AND METHODS FOR MAKING THE SAME

Plating of ceramic matrix composite parts as joining method in gas turbine hardware

Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate

Double-sided substrate, semiconductor device and method for the same

Ceramic circuit board and process for producing same

Ceramic-metal sealing structure, and associated method

Composite articles made by process for joining stainless steel part and zirconia ceramic part

Bonding structure and bonding method for cemented carbide element and diamond element, cutting tip and cutting element for drilling tool, and drilling tool

Composite articles made by process for joining bronze part and silicon carbide ceramic part

Composite articles made by process for joining brass part and silicon carbide ceramic part

Composite articles made by process for joining brass part and silicon carbide ceramic part

Process for joining brass part and silicone carbide ceramics part and composite articles made by same

Process for joining stainless steel part and silicon nitride ceramic part and composite articles made by same

Method for metallizing ceramic surface and method for connecting ceramic with aluminum

Ceramic/metal composite structure

Metal-ceramic substrate and method for manufacturing such a substrate

Composite articles made by process for joining stainless steel part and silicon carbide ceramic part

PROCESS FOR JOINING CARBON STEEL PART AND SILICON CARBIDE CERAMIC PART AND COMPOSITE ARTICLES MADE BY SAME

Electrostatic chuck and showerhead with enhanced thermal properties and methods of making thereof

Interface design of TSP shear cutters

Composite articles made by process for joining stainless steel part and titanium carbide ceramic part

Composite article made by process for joining stainless steel part and silicon carbide ceramic part

Composite articles made by process for joining stainless steel part and zirconia ceramic part

Self-supporting CVD diamond film and method for producing a self-supporting CVD diamond film

Metal-Ceramic Substrate

Y-Doped Barium Strontium Titanate For Stoichiometric Thin Film Growth

Aluminum nitride substrate, aluminum nitride circuit board, semiconductor apparatus, and method for manufacturing aluminum nitride substrate

METHOD FOR PRODUCING A CONNECTION OF GRAPHITE AND CARRIER METAL AND COMPOSITION ELEMENT

PROCESS FOR JOINING STAINLESS STEEL PART AND ALUMINA CERAMIC PART AND COMPOSITE ARTICLES MADE BY SAME

Flush joint

Joining device

Compliant material

Electrochemical cell with an electrolyte flow, comprising through-electrodes and production method

On the production of metal-ceramic compounds

POLYCRYSTALLINE DIAMOND

ABRASIVE INSERTS

Transient Migrating Phase Low Temperature Joining of Co-Sintered Particulate Materials Including a Chemical Reaction

SOLDER ALLOY

Manufacture of thermally stable cutting elements

Sputtering target for oxide thin film and process for producing the sputtering target

MULTILAYER CERAMIC SUBSTRATE AND PROBE BOARD USING PILLAR-TYPE CONDUCTOR AND FABRICATING METHODS OF THE SAME

NON-SHRINKING CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Power module substrate, power module, and method for manufacturing power module substrate

Power module substrate, power module, and method for manufacturing power module substrate

Double transition joint for the joining of ceramics to metals

Ceramic heater and gas sensor including the same

Continuous or discrete metallization layer on a ceramic substrate

INSULATING SUBSTRATE AND METHOD FOR PRODUCING THE SAME

Hermetic sealing assembly and electrical device including the same

Diamond bonded construction with improved braze joint

Sealed flexible link between a metal substrate and a ceramic substrate, method for making such a link, application of the method to sealing high temperature electrolyzers and fuel cells

Thermally stable polycrystalline ultra-hard constructions

Metal-ceramic substrate

CERAMIC SUBSTRATE, METHOD OF MANUFACTURING CERAMIC SUBSTRATE, AND METHOD OF MANUFACTURING POWER MODULE SUBSTRATE

Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material

Diffusion barriers in modified air brazes

Method for joining SiC-diamond

Wavelength-converted semiconductor light emitting device

Cutting tool insert

METHOD FOR OXIDE BONDING USING SOLDER ALLOY

COMPONENT HAVING A METALIZED CERAMIC BASE

Conductive Coatings, Sealing Materials and Devices Utilizing Such Materials and Method of Making

METHOD FOR PRODUCING A METALIZED COMPONENT, CORRESPONDING COMPONENT, AND A SUBSTRATE FOR SUPPORTING THE COMPONENT DURING METALIZATION

COMPONENT HAVING A CERAMIC BASE THE SURFACE OF WHICH IS METALIZED

Functionally graded high temperature bonding of fiberglass fibers to steel

Ceramic junction member, ceramic heater and gas sensor

NON-SHRINKING CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Reaction apparatus, fuel cell system and electronic device

Ceramic multilayer substrate and method for manufacturing the same

Component having a ceramic base with a metalized surface

Reaction Apparatus, Fuel Cell System and Electronic Device

MODULE INCLUDING A STABLE SOLDER JOINT

Method for the refractory assembly of a carbon material and a copper alloy

Bonded metal and ceramic plates for thermal management of optical and electronic devices

Microheat exchanger for laser diode cooling

THERMAL BARRIER SYSTEM AND BONDING METHOD

Bonding structure and bonding method for cemented carbide element and diamond element, cutting tip and cutting element for drilling tool, and drilling tool

Process for Producing Integrated Body from Aluminum Nitride Sintered Body and High-Melting Point Metal Member

Method of producing a material composite

Ceramic metal composite and semiconductor device using the same

Silicon nitride substrate, silicon nitride circuit board utilizing the same, and use thereof

JOINED COMPOSITE STRUCTURES WITH A GRADED COEFFICIENT OF THERMAL EXPANSION FOR EXTREME ENVIRONMENT APPLICATIONS

Semiconductor device and bonding material

Target formed of sintering-resistant material of high-melting point metal alloy, high-melting point metal silicide, high-melting point metal carbide, high-melting point metal nitride, or high-melting point metal boride, process for producing the target, assembly of the sputtering target-backing plate, and process for producing the same

Braze alloy containing particulate material

SOLDER ALLOY FOR OXIDE BONDING

Ceramic metal composite for orthopaedic implants

Cement for bonding an aluminum nitride arc tube body to a molybdenum electrode support, articles made therefrom, and methods for making same

Polycrystalline diamond constructions having improved thermal stability

Method for bonding refractory ceramic and metal

Solder alloy for bonding oxide material, and solder joint using the same

Brazed joint between a titanium-based metal part and a ceramic part based on silicon carbide (SIC) and/or carbon

Oriented fiber ceramic matrix composite abradable thermal barrier coating

Power semiconductor module

Silicon nitride substrate, a manufacturing method of the silicon nitride substrate, a silicon nitride wiring board using the silicon nitride substrate, and semiconductor module

LOW TEMPERATURE REACTIVE COMPOSITE JOINING

Method for manufacturing a metal-ceramic substrate

Carbon commutator and process for producing the same

Power semiconductor substrates with metal contact layer and method of manufacture thereof

Composite ceramic body, method of manufacturing the same and ceramic filter assembly

Diffusion barriers in modified air brazes

Joint between a metal part and a ceramic part based SiC and/or C