207469 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof; Manufacture of specific parts of devices defined in group; Making of isolation regions between components; Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
Sub-classes:MANUFACTURING METHOD FOR SEMICONDUCTOR STRUCTURE
#2MANUFACTURING METHOD FOR HYBRID SOI SUBSTRATE
#3INCREASING Q-TIME
#4INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE DIELECTRIC LAYER HAVING AIR GAP
#5FORMATION OF SINGLE CRYSTAL SEMICONDUCTORS USING PLANAR VAPOR LIQUID SOLID EPITAXY
#6DEVICE WITH ELECTRICAL COMPONENT FORMED OVER A CAVITY AND METHOD THEREFOR
#7Method Of Forming Backside Power Rails
#8METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
#9MANUFACTURING METHOD FOR HYBRID SOI SUBSTRATE
#10SEMICONDUCTOR STRUCTURE
#11STRUCTURE OF HIGH-RESISTIVITY SILICON-ON-INSULATOR EMBEDDED WITH CHARGE CAPTURE LAYER AND MANUFACTURE THEREOF
#12SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
#13METHODS FOR MAKING SEMICONDUCTOR DEVICES INCLUDING LOCALIZED SEMICONDUCTOR-ON-INSULATOR (SOI) REGIONS
#14SEMICONDUCTOR ON INSULATOR WAFER WITH CAVITY STRUCTURES
#15Methods of Forming Material Within Openings Extending into a Semiconductor Construction, and Semiconductor Constructions Having Fluorocarbon Material
#16STRAINED SEMICONDUCTOR USING ELASTIC EDGE RELAXATION OF A STRESSOR COMBINED WITH BURIED INSULATING LAYER
#17ISOLATION STRUCTURES IN MULTI-GATE SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
#18Integrated circuit structure with backside dielectric layer having air gap
#19COMPLEMENTARY FIELD-EFFECT TRANSISTOR DEVICE INCLUDING AT LEAST ONE FIN
#20BULK SEMICONDUCTOR SUBSTRATE WITH FULLY ISOLATED SINGLE-CRYSTALLINE SILICON ISLANDS AND THE METHOD FOR FORMING THE SAME
#21Formation of single crystal semiconductors using planar vapor liquid solid epitaxy
#22SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
#23Method of forming backside power rails
#24Method of manufacturing semiconductor device
#25Bulk Nanosheet with Dielectric Isolation
#26Semiconductor device
#27METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR SUBSTRATE
#28Method for manufacturing isolation structure of hybrid epitaxial area and active area in FDSOI
#29Semiconductor structure with shared well
#30SEMICONDUCTOR-ON-INSULATOR DEVICE WITH LIGHTLY DOPED EXTENSION REGION
#31Semiconductor devices and methods of manufacturing thereof
#32Semiconductor device including element isolation film and method for fabricating the same
#33Strained semiconductor using elastic edge relaxation of a stressor combined with buried insulating layer
#34Silicon-on-insulator with crystalline silicon oxide
#35Wafer scale bonded active photonics interposer
#36ISOLATION STRUCTURES IN MULTI-GATE SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
#37Isolation structures in multi-gate semiconductor devices and methods of fabricating the same
#38SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#39Integrated circuit structure with backside dielectric layer having air gap
#40Optical detection element and GOI device for ultra-small on-chip optical sensing, and manufacturing method of the same
#41Gap spacer for backside contact structure
#42Multiple thickness semiconductor-on-insulator field effect transistors and methods of forming the same
#43Method of forming backside power rails
#44Silicon on insulator structure and method of making the same
#45Method for manufacturing a polysilicon SOI substrate including a cavity
#46Gap spacer for backside contact structure
#47Formation of single crystal semiconductors using planar vapor liquid solid epitaxy
#48Integrated circuit structures with well boundary distal to substrate midpoint and methods to form the same
#49Semiconductor on insulator wafer with cavity structures
#50Method of manufacturing semiconductor device
#51Method for fabricating semiconductor device
#52Multi-layered polysilicon and oxygen-doped polysilicon design for RF SOI trap-rich poly layer
#53Vertically stacked field effect transistors
#54Semiconductor device
#55Multiple thickness semiconductor-on-insulator field effect transistors and methods of forming the same
#56Integrated circuit structure with backside dielectric layer having air gap
#57Integrated structure and manufacturing method thereof
#58VERTICALLY STACKED FIN SEMICONDUCTOR DEVICES
#59Isolation structures in multi-gate semiconductor devices and methods of fabricating the same
#60IC products formed on a substrate having localized regions of high resistivity and methods of making such IC products
#61Method for forming an electrical contact between a semiconductor film and a bulk handle wafer, and resulting structure
#62Methods of forming material within openings extending into a semiconductor construction, and semiconductor constructions having fluorocarbon material
#63Strained semiconductor using elastic edge relaxation of a stressor combined with buried insulating layer
#64Method for manufacturing a CFET device
#65Semiconductor device and method of manufacturing the same
#66Formation of single crystal semiconductors using planar vapor liquid solid epitaxy
#67Monolithic multi-bit weight cell for neuromorphic computing
#68Vertically stacked field effect transistors
#69Multi-layered polysilicon and oxygen-doped polysilicon design for RF SOI trap-rich poly layer
#70Semiconductor device and method for producing semiconductor device
#71Method of forming and transferring thin film using SOI wafer and heat treatment process
#72Vertically stacked fin semiconductor devices
#73Semiconductor device and method for fabricating the same
#74Wafer scale bonded active photonics interposer
#75Co-integration of bulk and SOI transistors
#76Bonded assembly including a semiconductor-on-insulator die and methods for making the same
#77Mode converter and method of fabricating thereof
#78Simplified memory cells based on fully-depleted silicon-on-insulator transistors
#79Semiconductor device and fabrication method thereof
#80Fin structures with bottom dielectric isolation
#81Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
#82SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME
#83Device forming method
#84Strained semiconductor using elastic edge relaxation of a stressor combined with buried insulating layer
#85Nonvolatile memory device having a memory-transistor gate-electrode provided with a charge-trapping gate-dielectric layer and two sidewall select-transistor gate-electrodes
#86Isolation cavities in semiconductor devices
#87Managed substrate effects for stabilized SOI FETs
#88Radio-frequency isolation using backside cavities
#89Multi-state device based on ion trapping
#90Silicon-on-insulator with crystalline silicon oxide
#91METHOD OF FORMING AN RF SILICON ON INSULATOR DEVICE
#92Fully depleted semiconductor-on-insulator transistors with different buried dielectric layer charges and different threshold voltages
#93Nanosheet FET with box isolation on substrate
#94Fully depleted semiconductor-on-insulator transistors with different buried dielectric layer charges and different threshold voltages
#95Deep fence isolation for logic cells
#96SOI substrate, semiconductor device and method for manufacturing the same
#97System and method for a transducer in an EWLB package
#98Field-effect transistors with a grown silicon-germanium channel
#99Backside reinforcement structure design for mirror flatness
#100Porous silicon relaxation medium for dislocation free CMOS devices
#101Integrated circuit heat dissipation using nanostructures
#102SiC-SOI device and manufacturing method thereof
#103Manufacturing method of semiconductor device
#104Integrated circuit heat dissipation using nanostructures
#105Laminated body and semiconductor device
#106Semiconductor-on-insulator finFET devices with high thermal conductivity dielectrics
#107Inverted T channel field effect transistor (ITFET) including a superlattice
#108Method for making an inverted T channel field effect transistor (ITFET) including a superlattice
#109Sealed cavity structures with non-planar surface features to induce stress
#110Bulk nanosheet with dielectric isolation
#111Transistor with gate extension to limit second gate effect
#112Composite semiconductor substrate, semiconductor device and method for manufacturing the same
#113Heterostructure system and method of fabricating the same
#114Fully-depleted CMOS transistors with u-shaped channel
#115SILICON GERMANIUM-ON-INSULATOR FORMATION BY THERMAL MIXING
#116RF switch on high resistive substrate
#117Integrated structure and manufacturing method thereof
#118Method of manufacturing semiconductor apparatus
#119Method for forming an electrical contact between a semiconductor film and a bulk handle wafer, and resulting structure
#120Mode converter and method of fabricating thereof
#121Methods of fabricating silicon-on-insulator (SOI) semiconductor devices using blanket fusion bonding
#122Manufacture of group IIIA-nitride layers on semiconductor on insulator structures
#123Radio-frequency isolation cavities and cavity formation
#124Topside radio-frequency isolation cavity configuration
#125Pillar-shaped semiconductor device and method for producing the same
#126Integrated circuit with metal gate having dielectric portion over isolation area
#127Battery structure with stable voltage for neuromorphic computing
#128Multi-state device based on ion trapping
#129System and method for a transducer in an eWLB package
#130SOI substrate, semiconductor device and method for manufacturing the same
#131Polycrystalline ceramic substrate, bonding-layer-including polycrystalline ceramic substrate, and laminated substrate
#132Radio-frequency isolation using porous silicon
#133Porous silicon relaxation medium for dislocation free CMOS devices
#134Semiconductor devices, and a method for forming a semiconductor device
#135Semiconductor device and manufacturing method thereof
#136Carrier for a semiconductor structure
#137Co-integration of bulk and SOI transistors
#138Managed substrate effects for stabilized SOI FETs
#139Semiconductor device
#140Method for manufacturing electronic device
#141Techniques and structure for forming thin silicon-on-insulator materials
#142Semiconductor constructions having fluorocarbon material
#143Growing Groups III-V lateral nanowire channels
#144Strained semiconductor using elastic edge relaxation of a stressor combined with buried insulating layer
#145Shallow trench isolation formation without planarization
#146Managed substrate effects for stabilized SOI FETs
#147Wide band gap transistors on non-native semiconductor substrates
#148Integrated circuit heat dissipation using nanostructures
#149Semiconductor structure and fabrication method thereof
#150Method of making a CMOS semiconductor device using a stressed silicon-on-insulator (SOI) wafer
#151Backside substrate openings in transistor devices
#152Integrated circuit heat dissipation using nanostructures
#153Method for reducing threading dislocation of semiconductor device
#154METAL OXIDE SEMICONDUCTOR (MOS) ISOLATION SCHEMES WITH CONTINUOUS ACTIVE AREAS SEPARATED BY DUMMY GATES AND RELATED METHODS
#155Semiconductor device with low band-to-band tunneling
#156Structure and method to form defect free high-mobility semiconductor fins on insulator
#157Switch element and load driving device
#158Strain retention semiconductor member for channel SiGe layer of pFET
#159Semiconductor structure
#160Method for manufacture of a semiconductor wafer suitable for the manufacture of an SOI substrate, and SOI substrate wafer thus obtained
#161Method of fabricating diamond-semiconductor composite substrates
#162Porous silicon relaxation medium for dislocation free CMOS devices
#163Porous silicon relaxation medium for dislocation free CMOS devices
#164Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
#165Cavity formation in backside interface layer for radio-frequency isolation
#166Thermal treatment system with collector device
#167Fully-depleted CMOS transistors with U-shaped channel
#168Lateral insulated-gate bipolar transistor and manufacturing method therefor
#169Bridging local semiconductor interconnects
#170Semiconductor device and fabrication method thereof
#171On-chip DC-DC power converters with fully integrated GaN power switches, silicon CMOS transistors and magnetic inductors
#172Semiconductor device and FinFET transistor
#173Device layer transfer with a preserved handle wafer section
#174Manufacture of Group IIIA-nitride layers on semiconductor on insulator structures
#175SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING THE SAME
#176Methods of fabricating silicon-on-insulator (SOI) semiconductor devices using blanket fusion bonding
#177Method, apparatus and system for back gate biasing for FD-SOI devices
#178SOI WAFERS AND DEVICES WITH BURIED STRESSOR
#179Semiconductor film with adhesion layer and method for forming the same
#180Bulk nanosheet with dielectric isolation
#181Bulk nanosheet with dielectric isolation
#182Structure and method to form defect free high-mobility semiconductor fins on insulator
#183Method for forming an electrical contact between a semiconductor film and a bulk handle wafer, and resulting structure
#184Devices and methods for dynamically tunable biasing to backplates and wells
#185Silicon on nothing devices and methods of formation thereof
#186System and method for a transducer in an eWLB package
#187Method of manufacturing silicon on insulator substrate
#188Semiconductor device including a recessed insulation region and fabrication method thereof
#189Front-Side Imager Having a Reduced Dark Current on a SOI Substrate
#190Silicon-on-plastic semiconductor device with interfacial adhesion layer
#191Semiconductor devices with cavities
#192Semiconductor structure and fabrication method thereof
#193Wide band gap transistor on non-native semiconductor substrate
#194Growing groups III-V lateral nanowire channels
#195Semiconductor device and method of manufacturing the same
#196RF switch on high resistive substrate
#197Process for smoothing the surface of a structure
#198Partially dielectric isolated fin-shaped field effect transistor (FinFET)
#199Semiconductor device and manufacturing method thereof
#200Method for producing one-time-programmable memory cells and corresponding integrated circuit
#201Radio-frequency isolation using front side opening
#202Method for manufacture of a semiconductor wafer suitable for the manufacture of an SOI substrate, and SOI substrate wafer thus obtained
#203Semiconductor structure and the manufacturing method thereof
#204Structure for radiofrequency applications and process for manufacturing such a structure
#205Backside coupled symmetric varactor structure
#206Porous silicon relaxation medium for dislocation free CMOS devices
#207Porous silicon relaxation medium for dislocation free CMOS devices
#208MOS transistor and method of manufacturing the same
#209Method for dissolving a silicon dioxide layer
#210Fin-shaped structure
#211Electronic device and method for manufacturing the same
#212Growing groups III-V lateral nanowire channels
#213Semiconductor Device With Self-Aligned Back Side Features
#214Conversion of strain-inducing buffer to electrical insulator
#215Bridging local semiconductor interconnects
#216Process for manufacturing a plurality of structures
#217Electronic device with hollowed-out rear plate
#218Silicon germanium-on-insulator formation by thermal mixing
#219Silicon germanium fin
#220METHOD OF FORMING FIN-SHAPED STRUCTURE
#221SILICON GERMANIUM-ON-INSULATOR FORMATION BY THERMAL MIXING
#222Semiconductor device, FinFET transistor and fabrication method thereof
#223Silicon germanium-on-insulator formation by thermal mixing
#224Radio frequency isolation using substrate opening
#225Radio frequency isolation cavity formation using sacrificial material
#226Channel SiGe devices with multiple threshold voltages on hybrid oriented substrates, and methods of manufacturing same
#227Substrate opening formation in semiconductor devices
#228Calibration method for heat treatment units
#229Method for fabricating an improved field effect device
#230Strained semiconductor using elastic edge relaxation of a stressor combined with buried insulating layer
#231Programmable active cooling device
#232SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
#233Efficient buried oxide layer interconnect scheme
#234Method of making a CMOS semiconductor device using a stressed silicon-on-insulator (SOI) wafer
#235Semiconductor device with low band-to-band tunneling
#236Multiple threshold voltage trigate devices using 3D condensation
#237Integrated circuit heat dissipation using nanostructures
#238Integrated circuit heat dissipation using nanostructures
#239FET device having a vertical channel in a 2D material layer
#240SOI based FINFET with strained source-drain regions
#241Semiconductor device and method for manufacturing the same
#2423D material modification for advanced processing
#243THRESHOLD VOLTAGE ADJUSTMENT IN METAL OXIDE SEMICONDUCTOR FIELD EFFECT TRANSISTOR WITH SILICON OXYNITRIDE POLYSILICON GATE STACK ON FULLY DEPLETED SILICON-ON-INSULATOR
#244Integrated circuit heat dissipation using nanostructures
#245Front-side imager having a reduced dark current on SOI substrate
#246Dual three-dimensional and RF semiconductor devices using local SOI
#247Transfer printing method
#248Dual gate FD-SOI transistor
#249Semiconductor film with adhesion layer and method for forming the same
#250Fin-shaped structure and method thereof
#251Mechanisms for forming radio frequency (RF) area of integrated circuit structure
#252High voltage metal oxide semiconductor field effect transistor integrated into extremely thin semiconductor on insulator process
#253Method of making embedded memory device with silicon-on-insulator substrate
#254Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
#255Boron rich nitride cap for total ionizing dose mitigation in SOI devices
#256Method for dissolving a silicon dioxide layer
#257Method of making a transistor
#258RF switch on high resistive substrate
#259Handle substrates of composite substrates for semiconductors
#260Three dimensional semiconductor device having lateral channel
#261P-FET with graded silicon-germanium channel
#262BACK BIASED TRANSISTOR AND CURRENT SOURCE BIASING
#263Silicon on nothing devices and methods of formation thereof
#264Process for fabricating a semiconductor-on-insulator substrate
#265Channel SiGe devices with multiple threshold voltages on hybrid oriented substrates, and methods of manufacturing same
#266Method for coupling a graphene layer and a substrate and device comprising the graphene/substrate structure obtained
#267Substrate arrangement
#268High voltage metal oxide semiconductor field effect transistor integrated into extremely thin semiconductor on insulator process
#269METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
#270Strain engineering in back end of the line
#271Flexible, stretchable electronic devices
#272Semiconductor-on-insulator structure and method of fabricating the same
#273Semiconductor-on-insulator with back side support layer
#274Silicon germanium-on-insulator formation by thermal mixing
#275Semiconductor structure and method of forming a harmonic-effect-suppression structure
#276Method of making a CMOS semiconductor device using a stressed silicon-on-insulator (SOI) wafer
#277Semiconductor device and method for forming the same
#278Silicon-on-nothing FinFETs
#279Semiconductor body with a buried material layer and method
#280Defective P-N junction for backgated fully depleted silicon on insulator mosfet
#281Method for producing a strained semiconductor on insulator substrate
#282RF SOI switch with backside cavity and the method to form it
#283Mechanisms for forming semiconductor device structure with floating spacer
#284DUAL GATE FD-SOI TRANSISTOR
#285Bridging local semiconductor interconnects
#286Field effect transistor including a regrown contoured channel
#287Mechanisms for forming radio frequency (RF) area of integrated circuit structure
#288Semiconductor film with adhesion layer and method for forming the same
#289Semiconductor-on-insulator structure and method of fabricating the same
#290Method of making a CMOS semiconductor device using a stressed silicon-on-insulator (SOI) wafer
#291Methods of forming semiconductor patterns including reduced dislocation defects and devices formed using such methods
#292Heat dissipative electrical isolation/insulation structure for semiconductor devices and method of making
#293Semiconductor structure and the manufacturing method thereof
#294METHOD FOR SEPARATION BETWEEN AN ACTIVE ZONE OF A SUBSTRATE AND ITS BACK FACE OR A PORTION OF ITS BACK FACE
#295Passive devices for FinFET integrated circuit technologies
#296Process for thinning the active silicon layer of a substrate of “silicon on insulator” (SOI) type
#297Semiconductor structure and method of forming a harmonic-effect-suppression structure
#298STRUCTURE AND METHOD OF HIGH-PERFORMANCE EXTREMELY THIN SILICON ON INSULATOR COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR TRANSISTORS WITH DUAL STRESS BURIED INSULATORS
#299Selective amorphization for signal isolation and linearity
#300Controlled process and resulting device