H01L2224/161 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector Disposition

• H01L2224/16104 » relative to the bonding area, e.g. bond pad 71
• H01L2224/16108 » the bump connector not being orthogonal to the surface 26
• H01L2224/16111 » the bump connector being disposed in a recess of the surface 75
• H01L2224/16112 » the bump connector being at least partially embedded in the surface 63
• H01L2224/16113 » the whole bump connector protruding from the surface 268
• H01L2224/1613 » the bump connector connecting within a semiconductor or solid-state body, i.e. connecting two bonding areas on the same semiconductor or solid-state body 24
• H01L2224/16135 » the bump connector connecting between different semiconductor or solid-state bodies i.e. chip-to-chip 10
• H01L2224/16151 » the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive 10

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