Assemblies with bond pads of two or more semiconductor devices electrically connected to the same surface of a plurality of leads

Leads under chip IC package

Methods of forming conductive through-wafer vias

Mold assembly for a package stack via bottom-leaded plastic (BLP) packaging

Test circuit under pad

Method for low loop wire bonding

Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same

High-frequency amplification device

Microelectronic assembly having a redistribution conductor over a microelectronic die

Flip-chip type semiconductor devices and conductive elements thereof

Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elements

CHIP PACKAGING STRUCTURE

Programmable radio transceiver

Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus

Semiconductor device and method of fabricating the same

System for reducing or eliminating semiconductor device wire sweep

Multi-part lead frame

Leadless semiconductor package and manufacturing method thereof

Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device

Carrier substrates and conductive elements thereof

Microelectronic assembly having encapsulated wire bonding leads

Low fabrication cost, high performance, high reliability chip scale package

Programmable radio transceiver

Multichip semiconductor package

Lead on chip semiconductor package

Surface-mountable semiconductor component and method for producing it

Stress and force management techniques for a semiconductor die

Wire bonding method and semiconductor device

Stacked electronic part

Semiconductor package having step type die and method for manufacturing the same

Board-on-chip packages

Thin-film semiconductor device and method of manufacturing the same

Method and apparatus for bonding a wire

Semiconductor package

Semiconductor device and electronic device

Wire bonding apparatus having actuated flame-off wand

High frequency module board device

Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same

Bonding pad arrangement method for semiconductor devices

Multiple-ball wire bonds

Via structure of packages for high frequency semiconductor devices

Low fabrication cost, high performance, high reliability chip scale package

LSI package, LSI element testing method, and semiconductor device manufacturing method

Packaged die on PCB with heat sink encapsulant and methods

Apparatus for encapsulating a multi-chip substrate array

Semiconductor package

Interconnect system without through-holes

Multiple die package

Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus

Semiconductor relay apparatus and wiring board fabrication method

Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods

Semiconductor integrated circuit device

Semiconductor device and a memory system including a plurality of IC chips in a common package

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Electronic device configured as a multichip module, leadframe and panel with leadframe positions

High density lead arrangement package structure

Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask

Microelectronic packages and methods therefor

SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING METHOD THEREOF

Method of producing a digital fingerprint sensor and the corresponding sensor

Semiconductor device with capacitor

Chip-on-board module, and method of manufacturing the same

Connector assembly

Wire-bonding method and semiconductor package using the same

Semiconductor package with wire bonded stacked dice and multi-layer metal bumps

Method for assembling a ball grid array package with two substrates

Trench-gate semiconductor devices

System and method for automated wire bonding

Semiconductor part for component mounting, mounting structure and mounting method

Flip-chip adaptor package for bare die

High performance RF inductors and transformers using bonding technique

Semiconductor device having radiation structure

Method of making microelectronic packages including electrically and/or thermally conductive element

Adaptable electronic storage apparatus

METHOD FOR PRODUCING WEDGE-WEDGE WIRE CONNECTION

Semiconductor integrated circuit having connection pads over active elements

Junction member comprising junction pads arranged in matrix and multichip package using same

Semiconductor device

Wafer level hermetic sealing method

Electronic component package

Semiconductor integrated circuit device

Microelectronic component assemblies and microelectronic component lead frame structures

Routing element for use in semiconductor device assemblies

Microelectronic component assemblies and microelectronic component lead frame structures

Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods

Methods of making microelectronic assemblies

Carrier, method of manufacturing a carrier and an electronic device

Semiconductor integrated circuit device

Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier

High frequency module

Semiconductor element having protruded bump electrodes

Multi-chip module and methods

Multi-part lead frame with dissimilar materials

Surface mount package

Strobe light control circuit and IGBT device

Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device

Leadless semiconductor package

Castellation wafer level packaging of integrated circuit chips

Shielding arrangement to protect a circuit from stray magnetic fields

Inverted J-lead for power devices

Method for ball grid array chip packages having improved testing and stacking characteristics

Structure and method for reinforcing a bond pad on a chip

Copper-based chip attach for chip-scale semiconductor packages

Arrangement with a semiconductor chip and support therefore and method for a bonded wire connection

Method for manufacturing thin GaAs die with copper-back metal structures

Semiconductor device and method of manufacturing thereof

Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method

Chip package and electrical connection structure between chip and substrate

Protective device

Resonator device, electronic equipment provided with resonator device and method of manufacturing resonator device

Packages for image sensitive electronic devices

Substrate for mounting semiconductor chip, mounting structure of semiconductor chip, and mounting method of semiconductor chip

Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers

Parallel design processes for integrated circuits

Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation

Multi-concentric pad arrangements for integrated circuit pads

Module assembly and method for stacked BGA packages

Highly reliable stack type semiconductor package

Low loop height ball bonding method and apparatus

Semiconductor/printed circuit board assembly, and computer system

Frame for semiconductor package

Semiconductor chip package and method

Transfer mold semiconductor packaging processes

Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the same

Method for producing an adhesive bond and adhesive bond between a chip and a planar surface

Lead frame and semiconductor device having the same as well as method of resin-molding the same

Stacked semiconductor device including improved lead frame arrangement

Radio frequency power amplifier module

Method of forming an electrical contact

Semiconductor chip and semiconductor device including lamination of semiconductor chips

Multi-chip module

Semiconductor device, electronic card and pad rearrangement substrate

Semiconductor device, electronic card and pad rearrangement substrate

Plastic package and method of fabricating the same

Semiconductor package capable of absorbing electromagnetic wave

Semiconductor device and method of fabricating the same

Semiconductor device and wire bonding method

Circuit device

Circuit device

Method for reduced input output area

Electromagnetic noise shielding in semiconductor packages using caged interconnect structures

Chip scale package and method of fabricating the same

System and method for reducing or eliminating semiconductor device wire sweep

Semiconductor device and method of enveloping an integrated circuit

Semiconductor component and production method suitable therefor

Integrated circuit with copper interconnect and top level bonding/interconnect layer

Semiconductor device

Simplified stacked chip assemblies

Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same

Chip package and electrical connection structure between chip and substrate

Optimization of routing layers and board space requirements for a ball grid array package

Optimization of routing layers and board space requirements for a ball grid array land pattern

Vertically stacked pre-packaged integrated circuit chips

Ball grid array package with patterned stiffener surface and method of assembling the same

Transistor having multiple gate pads

Method of forming low wire loops and wire loops formed using the method

Method of producing an electronic component and a panel with a plurality of electronic components

Circuit carrier and production thereof

Bridge connection type of chip package and fabricating method thereof

Semiconductor package

Wire bonding method and apparatus

Method for the lateral contacting of a semiconductor chip

Moisture-resistant electronic device package and methods of assembly

Super-thin high speed flip chip package

Lead frame

Wire bonding method, semiconductor chip, and semiconductor package

Integrated circuit, interface circuit used in the integrated circuit, and apparatus using the integrated circuit

Bonding pad design for impedance matching improvement

BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the same

Stacked chip package having upper chip provided with trenches and method of manufacturing the same

Semiconductor device with staggered electrodes and increased wiring width

Semiconductor device, semiconductor module and method of manufacturing semiconductor device

Leadless semiconductor package

High-frequency chip packages

Stacked microfeature devices and associated methods

Optimization of routing layers and board space requirements for ball grid array package implementations including array corner considerations

Active area bonding compatible high current structures

Semiconductor device and method for production thereof

Information media using information of defect in an article

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Substantially hermetic packages for semiconductor devices and substantially hermetically packaged, semiconductor devices

Singulation method used in leadless packaging process

Stacked chip assembly with encapsulant layer

Process to allow electrical and mechanical connection of an electrical device with a face equipped with contact pads

Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials

Electronic circuit device

Semiconductor memory module

High frequency circuit module

Semiconductor device and wire bonding apparatus

Multi-chip module

Semiconductor device and an electronic device

Molded ball grid array

Semiconductor die packages with recessed interconnecting structures

Semiconductor device and method of manufacturing the same

Wire bonders and methods of wire-bonding

Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads

Ultrathin leadframe BGA circuit package

Packaged microelectronic components

Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same

Electronic component protected against electrostatic discharges

Multi-chip module having bonding wires and method of fabricating the same

Semiconductor device and its manufacturing method

Packaged microelectronic devices and methods of forming same

Multi media card formed by transfer molding

Standoffs for centralizing internals in packaging process

Printed wiring board and manufacturing method therefor

Apparatus used to package multimedia card by transfer molding

Method and apparatus for attaching microelectronic substrates and support members

Method for making electronic devices including silicon and LTCC and devices produced thereby

Computer system including at least one stress balanced semiconductor package

Memory package

Semiconductor component having conductors with wire bondable metalization layers

Ball grid array structures having tape-based circuitry

Method of stacking semiconductor element in a semiconductor device

Process for fabricating a semiconductor package and semiconductor package with leadframe

Method for optimizing routing layers and board space requirements for a ball grid array land pattern

Semiconductor assembly encapsulation mold and method for forming same

Semiconductor device, semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module

Semiconductor unit with cooling system

Multiple die stack apparatus employing T-shaped interposer elements

Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths

Semiconductor device wiring structure

Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages

Substrate-less microelectronic package

Semiconductor device

Selective consolidation processes for electrically connecting contacts of semiconductor device components

Semiconductor package containing an integrated-circuit chip supported by electrical connection leads

Integrated circuit carrier

Chip scale package and method of fabricating the same

Adhesion enhanced semiconductor die for mold compound packaging

Leadless leadframe package substitute and stack package