Computing device including a stacked semiconductor device

Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts

Semiconductor device including a plurality of semiconductor chips stacked three-dimensionally, and method of manufacturing the same

Stacked microelectronic devices and methods for manufacturing microelectronic devices

Semiconductor device, semiconductor package for use therein, and manufacturing method thereof

Method for forming a double embossing structure

Chip package structure

Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices

Backside ground type flip chip semiconductor package

Semiconductor device package

Semiconductor multi-chip package including two semiconductor memory chips having different memory densities

Microfeature workpiece substrates having through-substrate vias, and associated methods of formation

Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader

Land grid array semiconductor device packages

Printed circuit board assembly with strain-alleviating structures

Quad flat pack (QFP) package and flexible power distribution method therefor

Test carrier for semiconductor components having conductors defined by grooves

Microelectronic devices and methods for manufacturing microelectronic devices

Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

Lead frame-based semiconductor device packages incorporating at least one land grid array package

Power semiconductor device having lines within a housing

BONDING PAD STRUCTURE AND METHOD OF FORMING THE SAME

Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip

Method for producing semiconductor device and semiconductor device

Method for producing an electronic component or module and a corresponding component or module

High frequency package, transmitting and receiving module and wireless equipment

Two layer substrate ball grid array design

Printed circuit board and method thereof and a solder ball land and method thereof

Multi-chip package for reducing parasitic load of pin

Thermally enhanced cavity down ball grid array package

Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features

Heat-conducting packaging of electronic circuit units

Underfilled semiconductor die assemblies and methods of forming the same

Semiconductor component comprising an interposer substrate

Power semiconductor device comprising a semiconductor chip stack and method for producing the same

Semiconductor device

Semiconductor power component with a vertical current path through a semiconductor power chip

Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly

Leadframe package with dual lead configurations

Bi-directional switch, and use of said switch

Semiconductor connection component

Semiconductor device and capacitance regulation circuit

Semiconductor device and capacitance regulation circuit

Applicant screening

METHODS OF FABRICATING A SEMICONDUCTOR DEVICE USING A PHOTOSENSITIVE POLYIMIDE LAYER AND SEMICONDUCTOR DEVICES FABRICATED THEREBY

Method and apparatus for fine pitch solder joint

Semiconductor device and a manufacturing method of the same

Multichip packages with exposed dice

Semiconductor chip and multi-chip package

Semiconductor device, laminated semiconductor device, and wiring substrate

Bonded structure and bonding method

Semiconductor device with improved contacts

Semiconductor component and method of manufacture

Mount for a programmable electronic processing device

Multi-chip semiconductor device package

Stack structure with semiconductor chip embedded in carrier

Printed circuit board, semiconductor package and multi-stack semiconductor package using the same

Thin IC package for improving heat dissipation from chip backside

Stackable single package and stacked multi-chip assembly

Semiconductor module

Semiconductor device and a manufacturing method of the same

Semiconductor device electronic component, circuit board, and electronic device

Integrated circuit package structure with gap through lead bar between a die edge and an attachment point corresponding to a conductive connector

Package frame and semiconductor package using the same

Semiconductor assembly and packaging for high current and low inductance

Semiconductor device

Insulated gate semiconductor device and manufacturing method thereof

Semiconductor device

Circuit board and manufacturing method thereof

Use of an internal on-chip inductor for electrostatic discharge protection of circuits which use bond wire inductance as their load

Method and apparatus for removing encapsulating material from a packaged microelectronic device

Packaged integrated circuit having a heat spreader and method therefor

Copper-metallized integrated circuits having electroless thick copper bond pads

Solder composition for electronic devices

Method for fabricating semiconductor package with heat sink

Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same

Chip packaging structure without leadframe

Board-on-chip package and stack package using the same

Package module having a stacking platform

SEMICONDUCTOR DEVICE

Integrated circuit package and method of assembling the same

Multilayered circuit substrate and semiconductor package structure using the same

Power plane design and jumper wire bond for voltage drop minimization

Stack package implementing conductive support

Semiconductor pressure sensor

SEMICONDUCTOR DEVICE

Jig structure for manufacturin a stacked memory card

Enhanced multi-die package

Radio frequency over-molded leadframe package

SEMICONDUCTOR DEVICE

High frequency semiconductor integrated circuit device, wireless electric unit and wireless communication system

Semiconductor device and method of manufacturing the same

Metal pad or metal bump over pad exposed by passivation layer

Electrical interconnect structures for integrated circuits and methods of manufacturing the same

Methods of bonding two semiconductor devices

Semiconductor module comprising components for microwave engineering in plastic casing and method for the production thereof

Connection structure semiconductor chip and electronic component including the connection structure and methods for producing the connection structure

Scalable subsystem architecture having integrated cooling channels

Radio frequency power amplifier module

Output match transistor

Semiconductor power device and RF signal amplifier

Semiconductor device

Semiconductor package

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE

Dual BGA alloy structure for improved board-level reliability performance

Microelectronic bond pad

Bonding pad fabrication method, method for fabricating a bonding pad and an electronic device, and electronic device

Integrated circuit chip and integrated device

Semiconductor device, power amplifier device and PC card

Semiconductor device for radio frequencies of more than 10 GHz and method for producing the device

Semiconductor device having capacitors for reducing power source noise

Substrate based IC-package

Copper substrate with feedthroughs and interconnection circuits

METHOD FOR PRODUCING A CHIP ARRANGEMENT, A CHIP ARRANGEMENT AND A MULTICHIP DEVICE

Packaged integrated circuit with enhanced thermal dissipation

Semiconductor package and manufacturing method thereof

Package structure having recession portion on the surface thereof and method of making the same

Chip package with asymmetric molding

Semiconductor package based on lead-on-chip architecture, the fabrication thereof and a leadframe for implementing in a semiconductor package

Wire bonding method and device of performing the same

Method and system for customized radio frequency shielding using solder bumps

Manufacturing process for chip package without core

Method and apparatus for attaching microelectronic substrates and support members

Low profile, chip-scale package and method of fabrication

Packaging method for segregating die paddles of a leadframe

Relay board with bonding pads connected by wirings

Connection element for a semiconductor component and method for producing the same

Method and apparatus for attaching microelectronic substrates and support members

Stress and force management techniques for a semiconductor die

Security apparatus

Reduced inductance in ball grid array packages

Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device

Ball grid array package and substrate within

Semiconductor chip package

Wiring substrate and semiconductor package implementing the same

Electronic component and electronic configuration

Packaging for high speed integrated circuits

Semiconductor device and method of manufacturing the same

Stacked semiconductor package having adhesive/spacer structure and insulation

Packaging for high speed integrated circuits

Packaging for high speed integrated circuits

Packaging for high speed integrated circuits

Semiconductor package without chip carrier and fabrication method thereof

Large die package structures and fabrication method therefor

Packaging for high speed integrated circuits

Packaging for high speed integrated circuits

Electronic device and carrier substrate for same

High-frequency device including high-frequency switching circuit

Electrically connecting substrate with electrical device

Method of realizing thermosonic wire bonding between metal wires and copper pads by depositing a thin film to surface of semiconductor chip with copper pads

Substrate applicable to both wire bonding and flip chip bonding, smart card modules having the substrate and methods for fabricating the same

Adhesive/spacer island structure for multiple die package

Bumped die and wire bonded board-on-chip package

Semiconductor device and a manufacturing method of the same

Method and structure for reduction of soft error rates in integrated circuits

Electronic component unit

Stacked Semiconductor Package having Adhesive/Spacer Structure and Insulation

Semiconductor power module with SiC power diodes and method for its production

MEMS packaging method for enhanced EMI immunity using flexible substrates

Semiconductor module

Chip package without core and stacked chip package structure thereof

Packaging of a microchip device

Package substrate and semiconductor package using the same

Semiconductor package having pre-plated leads and method of manufacturing the same

MEMS package using flexible substrates, and method thereof

Micro-package, multi-stack micro-package, and manufacturing method therefor

Method of realizing direct bonding between metal wires and copper pads by means of thermosonic wire bonding using shielding gas spraying device

Package structure for a semiconductor device incorporating enhanced solder bump structure

Integrated circuit for driving semiconductor device and power converter

Wire-bonding method and semiconductor package using the same

Semiconductor package having dual interconnection form and manufacturing method thereof

Hybrid conductive coating method for electrical bridging connection of RFID die chip to composite antenna

High frequency package device with internal space having a resonant frequency offset from frequency used

Ball grid array package enhanced with a thermal and electrical connector

SEMICONDUCTOR MULTI-CHIP PACKAGE

Surface mount package

Method for manufacturing semiconductor chip package

Lead frame, resin-encapsulated semiconductor device, and method of producing the same

Advanced leadframe having predefined bases for attaching passive components

Method of manufacturing a passive integrated matching network for power amplifiers

Semiconductor sensor and manufacturing method therefor

Cavity ball grid array apparatus having improved inductance characteristics

Method for producing a circuit module

Method and System for Applying an Adhesive Substance on an Electronic Device

Trenched MOSFET termination with tungsten plug structures

Substrate warpage control and continuous electrical enhancement

Method of reducing warpage in an over-molded IC package

METHOD OF FABRICATING A HIGH-DENSITY LEAD ARRANGEMENT PACKAGE STRUCTURE

Semiconductor device manufacturing method

Bonding apparatus and method

Semiconductor device with semiconductor device components embedded in a plastics composition

Semiconductor device with improved signal transmission characteristics

Semiconductor device advantageous in improving water resistance and oxidation resistance

Semiconductor device

Stacked semiconductor package

Adhesive layer forming a capacitor dielectric between semiconductor chips

BUMP FOR OVERHANG DEVICE

Anti-warp heat spreader for semiconductor devices

Semiconductor device and method of manufacturing the same

Package for electronic device and method for manufacturing electronic device

System and method for venting pressure from an integrated circuit package sealed with a lid

Apparatus having reduced warpage in an over-molded IC package

Semiconductor package having lead free conductive bumps and method of manufacturing the same

Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same

Semiconductor die package and method for making the same

Semiconductor device and package, and method of manufacturer therefor

Multi-part lead frame with dissimilar materials

Semiconductor device

Die package with asymmetric leadframe connection

Bonding apparatus and method

System, method and apparatus for routing signals from an integrated circuit using thickfilm and printed circuit interconnects

Assembly method for semiconductor die and lead frame

Methods of operating electronic devices, and methods of providing electronic devices

Circuitry component and method for forming the same

Ultrathin semiconductor circuit having contact bumps

Method of manufacturing a semiconductor device

Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer

Standoffs for centralizing internals in packaging process

Method of fabricating a stacked die in die BGA package

Method of fabricating a stacked die in die BGA package

Three dimensional device integration method and integrated device

Stacked die in die BGA package

Heat-dissipating semiconductor package and fabrication method thereof

Mounting and adhesive layer for semiconductor components

Post passivation structure for a semiconductor device and packaging process for same

Wire bonding structure to electrically connect a printhead chip to a flexible printed circuit of an ink cartridge and method thereof

Semiconductor half-bridge module with low inductance

Radio frequency receiver chip with improved electrostatic discharge level

Semiconductor device

Multi-chip device and method for producing a multi-chip device

Intrinsic thermal enhancement for FBGA package

Packaging logic and memory integrated circuits

Stacked memory card and method for manufacturing the same

Alignment using fiducial features

Reliable integrated circuit and package

Lead frame for semiconductor package

Semiconductor device

Semiconductor device having firmly secured heat spreader

Contact Structures Comprising A Core Structure And An Overcoat

Semiconductor device having through electrode and method of manufacturing the same

Semiconductor device and system having semiconductor device mounted thereon

Signal isolation in a package substrate

Substrate structure and the fabrication method thereof

Micro solder pot

Chip-on-board assemblies

Semiconductor device and circuit board

Component with sensitive component structures and method for the production thereof

Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same

CSP semiconductor chip and BGA assembly with enhanced physical protection, protective members and assemblies used with same, and methods of enhancing physical protection of chips and assemblies

Module with built-in component

Module having stacked chip scale semiconductor packages

Package structure of chip and the package method thereof

Chip-package structure and fabrication process thereof

Electronic component comprising a cooling surface

Power semiconductor module

Method for recording identification information on semiconductor chip, and imaging device

Wiring board, method for manufacturing same, and semiconductor package

Semiconductor module

Lead-frame type semiconductor package and lead frame thereof

Semiconductor device and manufacturing method therefor

Soldered assemblies and methods of making the same

Ball grid array package with thermally-enhanced heat spreader

Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device

Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods

Microelectronic loop packages

Leadless semiconductor package

Bond capillary design for ribbon wire bonding

Physical quantity sensor, lead frame, and manufacturing method therefor

Nickel bonding cap over copper metalized bondpads

Electronic circuit protection device

Circuit assembly with surface-mount IC package and heat sink

Electronic circuit protection device

Substrate structure of semiconductor package

Semiconductor package and fabrication method thereof

Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant

Assembly structure and method for chip scale package

Stacked chip security

Semiconductor device

Lead frame with attached components

Gate contact and runners for high density trench MOSFET

Trenched MOSFET device with contact trenches filled with tungsten plugs

Structure for avalanche improvement of ultra high density trench MOSFET

High density hybrid MOSFET device

High density trench MOSFET with low gate resistance and reduced source contact space

Source contact and metal scheme for high density trench MOSFET

Image sensor chip package and method of manufacturing the same

Curable silicone rubber composition and semiconductor device

Method of fabricating wiring board and method of fabricating semiconductor device

Surface mount type semiconductor device and method of manufacturing the same

Method for modified bus bar with Kapton™ tape or insulative material on LOC packaged part

Method of forming overhang support for a stacked semiconductor device

Manufacturing method for an electronic component assembly and corresponding electronic component assembly

Method of making semiconductor BGA package having a segmented voltage plane

Method for producing a protective assembly for protecting an electronic component from electrostatic discharge, and correspondingly configured electronic component

Methods for packaging an image sensor and a packaged image sensor

Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packaging

Semiconductor element and manufacturing method thereof