Lead frame and method for manufacturing semiconductor package with the same

High density lead arrangement package structure

Lead frame for semiconductor package and method of fabricating semiconductor package

Semiconductor light emitting device

White light emitting element and white light source

Packaged microelectronic imagers and methods of packaging microelectronic imagers

Laser cleaning system for a wire bonding machine

Wire bonding method and apparatus

Wire bonding apparatus

Bonding arm swinging type bonding apparatus

Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit

Thin-film capacitor device, mounting module for the same, and method for fabricating the same

Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask

Microelectronic packages and methods therefor

SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING METHOD THEREOF

Method of producing a COF flexible printed wiring board

Wafer level semiconductor component having thinned, encapsulated dice and polymer dam

Semiconductor device and method of manufacturing same

Semiconductor device for wire-bonding and flip-chip bonding package and manufacturing method thereof

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Thermoconductive curable liquid polymer composition and semiconductor device produced with the use of this composition

Semiconductor copper bond pad surface protection

Ultraviolet sensor and method for manufacturing the same

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Optoelectronic hybrid integrated module and light input/output apparatus having the same as component

Method of producing a digital fingerprint sensor and the corresponding sensor

Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density

Electronic circuit module

Semiconductor device and method of manufacturing the same

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Thermal head and bonding connection method therefor

Method for fabricating a structure for making contact with a device

Light emitting diode display device comprising a high temperature resistant overlay

Semiconductor light emitting device provided with a light conversion element using a haloborate phosphor composition

Semiconductor component having stiffener, stacked dice and circuit decals

Flip-chip attach structure

Semiconductor device and manufacturing method thereof

Semiconductor device with capacitor

Diamond-silicon hybrid integrated heat spreader

Thermally enhanced metal capped BGA package

Method for fabricating semiconductor component with stiffener and circuit decal

IC module, and wireless information-storage medium and wireless information-transmitting/receiving apparatus including the IC wireless

Miniaturized chip scale package structure

Method of forming a leadframe for a semiconductor package

Isolation structure configurations for modifying stresses in semiconductor devices

Chip assembly in a premold housing

Integrated getter area for wafer level encapsulated microelectromechanical systems

Semiconductor memory device and defect remedying method thereof

Light emitting diode

Semiconductor device and manufacturing method thereof, liquid crystal television system, and EL television system

Method for preparing integrated circuit modules for attachment to printed circuit substrates

Electronic part mounting substrate, electronic part, and semiconductor device

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Optical communications module

BUMPING PROCESS OF LIGHT EMITTING DIODE

Wafer-level chip scale package and method for fabricating and using the same

Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles

Bumping process of light emitting diode

Method for manufacturing semiconductor device

Method of manufacturing hybrid integrated circuit device

Chip-on-board module, and method of manufacturing the same

Manufacturing method of a semiconductor device utilizing a flexible adhesive tape

PACKAGE STRUCTURE OF OPTICAL DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device, semiconductor laser device, manufacturing method for semiconductor device, manufacturing method for semiconductor laser device, optical disk device and optical transmission system

Wafer packaging process of packaging light emitting diode

Compact optical sub-assembly with integrated flexible circuit

Optical sub-assembly for opto-electronic modules

High-frequency power amplifier module

Backlight

Light emitting diode and method for fabricating the same

Mining light

LED light sources for image projection systems

Wiring substrate, solid-state imaging apparatus using the same, and manufacturing method thereof

FBAR based duplexer device and manufacturing method thereof

Light-emitting structures

Optically interactive device package array

Method of manufacturing a sensor device with binding material having a foaming agent

Wafer-level package and method for production thereof

High density vertically stacked semiconductor device

Semiconductor device having bonding pad above low-k dielectric film

Process for making fine pitch connections between devices and structure made by the process

Semiconductor device and method of manufacturing the same

Microelectronic assembly having array including passive elements and interconnects

Connector assembly

Quad flat non-leaded package comprising a semiconductor device

Wire-bonding method and semiconductor package using the same

Protective structures for bond wires

Semiconductor package with wire bonded stacked dice and multi-layer metal bumps

Method for assembling a ball grid array package with two substrates

Semiconductor package and method for manufacturing the same

Stacked semiconductor device having mask mounted in between stacked dies

Semiconductor package with passive device integration

Trench-gate semiconductor devices

Surface-mount type light emitting diode and method for manufacturing it

Multi-pin light-emitting diode device

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Optical bench, slim optical pickup employing the same and method of manufacturing the optical bench

Brazing filler metal, assembly method for semiconductor device using same, and semiconductor device

System and method for automated wire bonding

Packaging structure and component installation method for oscillator

Sensor stem, sensor device having the same, and method of manufacturing sensor device

High performance system-on-chip discrete components using post passivation process

Methods for reducing flip chip stress

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Conductive bond for through-wafer interconnect

Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment

Three-dimensional semiconductor package, and spacer chip used therein

Fabrication method of semiconductor package with photosensitive chip

Method of forming a stack of packaged memory dice

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Compliant wirebond pedestal

Method of manufacturing a semiconductor device including electrodes on main and reverse sides of a semiconductor chip

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Method for making a micromechanical device by using a sacrificial substrate

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Method and apparatus reducing electrical and thermal crosstalk of a laser array

Optical head with light-receiving device

Light emitting apparatus

Module with a built-in component, and electronic device with the same

Chip packaging module with active cooling mechanisms

Surface mount optoelectronic component

Contact sensor package

Light-emitting semiconductor device with a built-in overvoltage protector

Signal line circuit device

Power module

Resin-encapsulation semiconductor device and method for fabricating the same

Carrier

Semiconductor part for component mounting, mounting structure and mounting method

Flip-chip adaptor package for bare die

Semiconductor module having heat sink serving as wiring line

Semiconductor device including semiconductor element mounted on another semiconductor element

Bumped IC, display device and electronic device using the same

Semiconductor device and method for manufacturing the same

Semiconductor device and method of fabricating the same

Pre-solder structure on semiconductor package substrate and method for fabricating the same

High performance RF inductors and transformers using bonding technique

Solder alloy and semiconductor device

Bumpless wafer scale device and board assembly

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Semiconductor device having radiation structure

Method and apparatus for high electrical and thermal performance ball grid array package

Microelectronic adaptors, assemblies and methods

Circuit carrier and package structure thereof

Method of making microelectronic packages including electrically and/or thermally conductive element

Stacked semiconductor device

Adaptable electronic storage apparatus

Semiconductor device, its fabrication method and electronic device

Semiconductor device and manufacturing method thereof

Substrate for packaging semiconductor chip and method for manufacturing the same

Film substrate, fabrication method thereof, and image display substrate

Structure and method for improved heat conduction for semiconductor devices

Semiconductor device and method of manufacturing same

Method of fabricating wafer-level packaging with sidewall passivation and related apparatus

Electronic devices and its production methods

Semiconductor device and method of manufacturing same

Assembly and method for modified bus bar with Kapton™ tape or insulative material on LOC packaged part

Lead frame, semiconductor chip package using the lead frame, and method of manufacturing the semiconductor chip package

Integrated circuit package with transparent encapsulant and method for making thereof

Surface mountable hermetically sealed package

Wafer collective reliability evaluation device and wafer collective reliability evaluation method

High Q factor integrated circuit inductor

Semiconductor element for solid state image sensing device and solid state image sensing device using the same

Power semiconductor devices and methods of manufacture

Photoelectric conversion device, and image sensor and image input system making use of the same

Silicon nitride insulating substrate for power semiconductor module

Device and method for emitting output light using Group IIB element Selenide-based phosphor material

Device and method for emitting output light using group IIB element selenide-based phosphor material

Light emitting diode

METHOD FOR PRODUCING WEDGE-WEDGE WIRE CONNECTION

Bonding method, bonding apparatus and bonding program

Bonding pattern discrimination method, bonding pattern discrimination device and bonding pattern discrimination program

Interconnection device and system

Selective passivation of exposed silicon

Methods of forming backside connections on a wafer stack

Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same

Method of fabricating a pad over active circuit I.C. with meshed support structure

Method for fabricating a chip scale package using wafer level processing

Flip chip packaging process employing improved probe tip design

Micro-mirror package

Circuit substrate for packaging semiconductor device, method for producing the same, and method for producing semiconductor device package structure using the same

Semiconductor laser device, optical transmission device, optical transmission system, electronic device, control device, connector, communication device, and optical transmission method and data transmission and reception method

Module for optical devices, and manufacturing method of module for optical devices

Semiconductor device and manufacturing method of them

Multi-wire board, its manufacturing method, and electronic apparatus having the multi-wire board

Surface-mount base for electronic element

Method for mounting a driver IC chip and a FPC board/TCP/COF device using a single anisotropic conductive film

Liquid jet head and liquid jet apparatus

Combination radio frequency identification transponder (RFID tag) and magnetic electronic article surveillance (EAS) tag

Lange coupler system and method

Internally generating patterns for testing in an integrated circuit device

Light emitting device

Chip and multi-chip semiconductor device using thereof and method for manufacturing same

Semiconductor integrated circuit having connection pads over active elements

Adhesion by plasma conditioning of semiconductor chip

Semiconductor device

Package of a semiconductor device with a flexible wiring substrate and method for the same

Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus

WAFER-LEVEL PACKAGE STRUCTURE

Semiconductor device

Power converter, power system provided with same, and mobile body

Area array packages with overmolded pin-fin heat sinks

Semiconductor device, module for optical devices, and manufacturing method of semiconductor device

Apparatus for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer

Semiconductor device having conducting portion of upper and lower conductive layers

Semiconductor device

Method for interconnecting an integrated circuit multiple die assembly

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Room temperature metal direct bonding

Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate

Junction member comprising junction pads arranged in matrix and multichip package using same

Hermetic surface mounted power package

Semiconductor device

HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD OF THE SAME

HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF

Flip chip assemblies and lamps of high power GaN LEDs, wafer level flip chip package process, and method of fabricating the same

Power module and power module assembly

Method of making wireless semiconductor device, and leadframe used therefor

Light emitting apparatus

Wafer level hermetic sealing method

Package of a semiconductor device with a flexible wiring substrate and method for the same

Semiconductor package with photosensitive chip and fabrication method thereof

Interconnect structure for power transistors

Light-radiating semiconductor component with a luminescence conversion element

Manufacturing method and device for white light emitting

White light emitting diode and method for manufacturing the same

Light emitting diodes packaged for high temperature operation

Methods of fabricating nanostructures and nanowires and devices fabricated therefrom

Optical sensor module with semiconductor device for drive

ULTRA-FINE CONTACT ALIGNMENT

Method of manufacturing mounting boards

Method and apparatus for forming metal contacts on a substrate

Microparticle loaded solder preform allowing bond site control of device spacing at micron, submicron, and nanostructure scale

System for reducing oxidation of electronic devices

Apparatus and methods for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer

Hybrid integrated circuit device and method of manufacturing the same

Hermetic passivation structure with low capacitance

Masking layer in substrate cavity

Manufacturing method for resin sealed semiconductor device

Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink

Semiconductor device and method of fabricating the same

Method and apparatus for using light emitting diodes for curing

Resin composition for encapsulating semiconductor

Structure and method for temporarily holding integrated circuit chips in accurate alignment

Optical data link and method of manufacturing optical data link

Nitride semiconductor laser device mounted on a stem

Integrated heat spreader package for heat transfer and for bond line thickness control and process of making

Driver chip and display apparatus including the same

Methods and apparatus for automotive radar sensors

Integrated circuit device with multiple chips in one package

Device and method for emitting output light using group IIB element selenide-based phosphor material and/or thiogallate-based phosphor material

Device and method for emitting output light using group IIB element selenide-based and group IIA element gallium sulfide-based phosphor materials

Light emitting device

Damascene interconnection and semiconductor device

Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same

Semiconductor device structures including protective layers formed from healable materials

Colored conductive wires for a semiconductor package

Die attach by temperature gradient lead free soft solder metal sheet or film

Method for manufacturing connection construction

Semiconductor apparatus

Thin semiconductor package including stacked dies

Process for producing a semiconductor device

Integrated device including connections on a separate wafer

Support ring for use with a contact pad and semiconductor device components including the same

Electronic component package

Semiconductor sensor

Semiconductor integrated circuit device

Structure of gold fingers

Method of packaging an optical sensor

Microelectronic component assemblies and microelectronic component lead frame structures

Partially populated ball grid design to accommodate landing pads close to the die

Semiconductor device including semiconductor elements mounted on base plate

Semiconductor package including flex circuit, interconnects and dense array external contacts

Quad flat flip chip package and leadframe thereof

Routing element for use in semiconductor device assemblies

Microelectronic component assemblies and microelectronic component lead frame structures

Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods

Reduced size semiconductor package with stacked dies

Flipchip QFN package

Concealable chip leadframe unit structure

Semiconductor chip leadframe module

Semiconductor device having passive component and support substrate with electrodes and through electrodes passing through support substrate

Semiconductor device

Fuse structure for semiconductor integrated circuit with improved insulation film thickness uniformity and moisture resistance

Die package having an adhesive flow restriction area

Semiconductor device

Optical communications module and method for producing the module

Semiconductor light emitting element

Semiconductor device using LED chip

Light-emitting diode with prevention of electrostatic damage

Light-emitting diode chip package body and packaging method thereof

White-light LED and method for regulating the generated light color of the white-light LED

Test assembly including a test die for testing a semiconductor product die

Hydrogen vent for optoelectronic packages with resistive thermal device (RTD)

Mounting board and electronic device using same

Electronic component mounting method and apparatus

Pressure sensor contained in casing

Methods of making microelectronic assemblies

Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby

Methods and apparatus to reduce growth formations on plated conductive leads

Method for compensating for CTE mismatch using phase change lead-free super plastic solders