Coaxial through chip connection

Post-attachment chip-to-chip connection

Tack & fuse chip bonding

Routingless chip architecture

Semiconductor device and method for manufacturing the same

Rigid-backed, membrane-based chip tooling

Integrated thin-film capacitor with etch-stop layer, process of making same, and packages containing same

Through chip connection

Semiconductor module

Technique for manufacturing an overmolded electronic assembly

Lead-frame type semiconductor package and lead frame thereof

Wafer level bumpless method of making a flip chip mounted semiconductor device package

Packaging method and package using the same

Semiconductor device packaging substrate and semiconductor device packaging structure

Chip-based thermo-stack

Optical device, method of manufacturing the same, optical module, optical transmission system

Method of removing the growth substrate of a semiconductor light emitting device

Method for manufacturing laser devices

Wiring substrate and bonding pad composition

Method and system for wavelength specific thermal irradiation and treatment

LED backlighting for displays

LED package, manufacturing method thereof, and LED array module using the same

Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitors

Decoupling capacitor for an integrated circuit and method of manufacturing thereof

Imaging device and digital camera

Probe card assembly and kit

White LED

Apparatus and method for manufacturing a semiconductor device

Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state

Protected chip stack

Semiconductor device and manufacturing method therefor

Pre-solder structure on semiconductor package substrate and method for fabricating the same

Integrated electronic chip and interconnect device and process for making the same

Soldered assemblies and methods of making the same

Active packaging

Chip spanning connection

Inverse chip connector

Chip connector

Post & penetration interconnection

Stack circuit member and method

Triaxial through-chip connection

Profiled contact

Chip capacitive coupling

Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus

Metal bump with an insulation for the side walls and method of fabricating a chip with such a metal bump

Electronic chip contact structure

Patterned contact

Die stacking recessed pad wafer design

Ball grid array package with thermally-enhanced heat spreader

Method for forming wafer-level heat spreader structure and package structure thereof

Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device

Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods

Laminated semiconductor package

Contact-based encapsulation

Plastic integrated circuit package, leadframe and method for use in making the package

Microelectronic loop packages

Leadless semiconductor package

Optoelectronic system and method for its manufacture

White light-emitting diode and manufacturing method therefor

Wafer-level chip scale packaging for LED comprising carrier substrate with thermally conductive through holes and fill channels

Reflection type light-emitting diode device

Light-emitting device

Semiconductor module

Bond capillary design for ribbon wire bonding

Membrane-based chip tooling

Mounting device and method thereof

Physical quantity sensor, lead frame, and manufacturing method therefor

Non-rigid conductor link measurement sensor and method for the production thereof

METHOD FOR FORMING BUMPS

Capping copper bumps

Nickel bonding cap over copper metalized bondpads

Method for operating an H-bridge drive utilizing a pair of high and low side MOSFETS

Method for making electronic devices

Microelectronic assemblies having low profile connections

Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors

Substrate structure for an image sensor package and method for manufacturing the same

Planar array contact memory cards

Tri-level inverter

Electronic circuit protection device

Circuit assembly with surface-mount IC package and heat sink

Electronic package whereby an electronic assembly is packaged within an enclosure that is designed to act as a heat pipe

Electronic apparatus with thermal module

Driver IC package with improved heat dissipation

Image display device and light emission device

Semiconductor light-emitting device with wavelength change material

Electronic circuit protection device

Silicon wafer with solderable coating on its wafer rear side, and process for producing it

Power unit

FLIP CHIP PACKAGE AND METHOD OF CONDUCTING HEAT THEREFROM

Semiconductor device having reduced number of external pad portions

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Substrate structure of semiconductor package

Semiconductor package and fabrication method thereof

Semiconductor IC and its manufacturing method, and module with embedded semiconductor IC and its manufacturing method

Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant

Assembly structure and method for chip scale package

Three-dimensional multichip stack electronic package structure

Stacked chip security

Optoelectronic semiconductor assembly with an optically transparent cover, and a method for producing optoelectronic semiconductor assembly with an optically transparent cover

Chip package

Semiconductor device and the manufacturing method for the same

Semiconductor device

Lead frame with attached components

Method of wafer-level packaging using low-aspect ratio through-wafer holes

Gate contact and runners for high density trench MOSFET

Trenched MOSFET device with contact trenches filled with tungsten plugs

Structure for avalanche improvement of ultra high density trench MOSFET

High density hybrid MOSFET device

High density trench MOSFET with low gate resistance and reduced source contact space

Source contact and metal scheme for high density trench MOSFET

Semiconductor device having die attachment and die pad for applying tensile or compressive stress to the IC chip

High power LED package and fabrication method thereof

Side-emitting LED package and method of manufacturing the same

Light emitting device, method for making the same, and nitride semiconductor substrate

Light-emitting diode and process for producing the same

Image sensor chip package and method of manufacturing the same

Heating apparatus

Wiring board and manufacturing method of wiring board

Semiconductor device mounting chip having tracing function

Memory module, cache system and address conversion method

Biomarkers sensing

Curable silicone rubber composition and semiconductor device

Method of fabricating wiring board and method of fabricating semiconductor device

Semiconductor package and method for forming the same

Method for manufacturing antenna and method for manufacturing semiconductor device

Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat

Surface mount type semiconductor device and method of manufacturing the same

Method for modified bus bar with Kapton™ tape or insulative material on LOC packaged part

Semiconductor device and method for manufacturing the same

Method of forming overhang support for a stacked semiconductor device

Integrated circuit package substrate having a thin film capacitor structure

Manufacturing method for an electronic component assembly and corresponding electronic component assembly

Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts

Method of making semiconductor BGA package having a segmented voltage plane

System and method for polymer encapsulated solder lid attach

Method for attaching dice to a package and arrangement of dice in a package

CMOS type image sensor module having transparent polymeric encapsulation material

Light emitting device having a layer of photonic crystals and a region of diffusing material and method for fabricating the device

Method and circuit structure employing a photo-imaged solder mask

Method of fabricating light emitting diode package

Method of manufacturing light emitting diodes

Bidirectional optical module and light transmitting apparatus

Protection circuit

Rectifier diode of electric generator

Backlight unit having light emitting diodes and method for manufacturing the same

Wireless device enclosure using piezoelectric cooling structures

Method for producing a protective assembly for protecting an electronic component from electrostatic discharge, and correspondingly configured electronic component

Vehicle rearview assembly having a light sensor with two or more transducers

Image pick-up element assembly and image pick-up element

Methods for packaging an image sensor and a packaged image sensor

Electric component with a protected current feeding terminal

Microelectronic inductor with high inductance magnetic core

Epoxy bump for overhang die

Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packaging

Semiconductor element and manufacturing method thereof

Semiconductor device

Wiring board and semiconductor device

Method for mounting an electronic part on a substrate using a liquid containing metal particles

Inductive filters and methods of fabrication therefor

Semiconductor device including a plurality of semiconductor chips and a plurality of through-line groups

Through electrode and method for forming the same

Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device

Structure and method for bond pads of copper-metallized integrated circuits

Method of making an electronic device using an electrically conductive polymer, and associated products

Integrated circuit device

Taped semiconductor device and method of manufacture

Semiconductor device having capacitive insulation means and communication terminal using the device

Semiconductor device, laminated semiconductor device, and method for producing semiconductor device

Circuit device and method of manufacturing the same

Memory module with improved mechanical strength of chips

Power module package structure

Semiconductor device

Encapsulated power semiconductor assembly

Varied-thickness heat sink for integrated circuit (IC) package

Package and method for attaching an integrated heat spreader

Graded liquid crystal polymer package

Electrical component and production thereof

Semiconductor BGA package having a segmented voltage plane

System for assembling electronic components of an electronic system

Stacked semiconductor package assembly having hollowed substrate

Integrated circuit package having stacked integrated circuits and method therefor

Semiconductor device modules, semiconductor devices, and microelectronic devices

Image sensitive electronic device packages

Hollow package and semiconductor device using the same

Microelectronic device with integrated energy source

Semiconductor device

Method for efficiently producing removable peripheral cards

Tab package connecting host device element

Lead frame, semiconductor device, method for producing semiconductor device, and injection mold

Methods of making integrated circuits

Electronic component including a shielding metal film disposed on a resin layer

Capacitor device, semiconductor devioce, and setting method of terminal capacitance of pad electrode thereof

Semiconductor photodetector and photodetecting device having layers with specific crystal orientations

Light emitting apparatus and method of manufacturing the same

High-brightness LED with protective function of electrostatic discharge damage

Manufacturing method and device for white light emitting

High power light emitting diode package and fabrication method thereof

Light source with a light-emitting element

Light emitting diode with high aspect ratio submicron roughness for light extraction and methods of forming

LED luminaire

White light emitting device

Semiconductor device, semiconductor device manufacturing method, and semiconductor device test method

Semiconductor bond pad structures and methods of manufacturing thereof

Optical die-down quad flat non-leaded package

Chip package and wire bonding process thereof

Surface mount package

Panel and semiconductor device having a composite plate with semiconductor chips

Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

Semiconductor device

Integrated circuit with substantially perpendicular wire bonds

Semiconductor device

Offset solder bump method and apparatus

Method and apparatus for RFID device assembly

Semiconductor device

System and method for die attach using a backside heat spreader

Method of manufacturing a solid-state image-sensing device including filling up a gap with insulating resin, and solid-state image-sensing device

Semiconductor package and leadframe therefor having angled corners

Stacked module systems and method

Interposer, method of fabricating the same, and semiconductor device using the same

Method of bonding a microelectronic die to a substrate and arrangement to carry out method

CHIP-TYPE MICRO-CONNECTOR AND METHOD OF PACKAGING THE SAME

Assembly of a semiconductor die attached to substrate with oxazoline derivative bearing an electron donor or acceptor functionality

Soldering method for semiconductor optical device, and semiconductor optical device

Systems and arrangements to assess thermal performance

Semiconductor chip with coil element over passivation layer

Composite material, electrical circuit or electric module

Jig structure for manufacturing an image sensor

Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboard

Semiconductor laser device and optical pickup apparatus having the device

Diode laser component with an integrated cooling element

Memory module and memory system

Computer memory cards using flash EEprom integrated circuit chips and memory-controller systems

Light source adapted for LCD back-lit displays

Modular light emitting diode

Electronic circuit device including electric element and varistor on substrate and its manufacture method

Analog data-input device provided with a pressure sensor of a microelectromechanical type

Smart radio frequency identification (RFID) items

Semiconductor integrated circuit device

CHIP PACKAGE STRUCTURE

Methods and apparatuses for encapsulating microelectronic devices

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Wafer level pre-packaged flip chip systems

Multi-chip module and methods

Wafer level electro-optical simiconductor manufacture fabrication mechanism and a method for the same

Microelectronic assemblies having compliant layers

Wafer level pre-packaged flip chip

Semiconductor device packages with substrates for redistributing semiconductor device electrodes

Multilayer module and method of manufacturing the same

SIP type package containing analog semiconductor chip and digital semiconductor chip stacked in order, and method for manufacturing the same

Sealing membrane for thermal interface material

Chip package having chip extension and method

Flexible core for enhancement of package interconnect reliability

Low cost power semiconductor module without substrate

Semiconductor package substrate with embedded resistors and method for fabricating same

Semiconductor device

Stacked chip package with redistribution lines

Micromodule, particularly for chip card

LED package structure and method making of the same

System-in-a-package based flash memory card

Semiconductor package and stack arrangement thereof

Leadframeless package structure and method

Backside method for fabricating semiconductor components with conductive interconnects

Ultra thin image sensor package structure and method for fabrication

Integrated light-emitting device

Solid element device and method for manufacturing the same

LED lamp and LED lamp apparatus

Base structure for light emitting device and light emitting device using the same

Array-type modularized light-emitting diode structure and a method for packaging the structure

Microelectronic imagers and methods of packaging microelectronic imagers

Vertical nitride based semiconductor light emitting device having improved light extraction efficiency

Light emitting device package and method for manufacturing the same

Adherence of a solid-state image-sensing device to a substrate

Method and device for producing a bondable area region on a carrier

Low range bonding tool

Mask and method for electrokinetic deposition and patterning process on substrates

NANO IC

Semiconductor device including an on-chip coil antenna formed on a device layer which is formed on an oxide film layer

Screen mask

Method of manufacturing component-embedded printed wiring board

Method of reducing process steps in metal line protective structure formation

Ball film for integrated circuit fabrication and testing

Semiconductor device and fabrication method thereof

Wiring board

Method for manufacturing electronic component-embedded printed circuit board

Wafer level pre-packaged flip chip

Method and system for solder die attach

Method of bonding solder pads of flip-chip package

Semiconductor device and method of fabricating the same

Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor device

Integrated getter area for wafer level encapsulated microelectromechanical systems

Wafer-level electro-optical semiconductor manufacture fabrication method

Light-emitting diode, method for making light-emitting diode, integrated light-emitting diode and method for making integrated light-emitting diode, method for growing a nitride-based III-V group compound semiconductor, light source cell unit, light-emitting diode

Fabrication method of IC inlet, ID tag, ID tag reader and method of reading date thereof

Illuminated electric toothbrushes and methods of use

Offset integrated circuit package-on-package stacking system

Electro-optical device and method for manufacturing the same

CIS Package and Method Thereof

Integrated circuit package including miniature antenna

Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof