Lens compression molded over LED die

Adhesive of epoxy acrylate, non-unsaturated resin and bis(methacryloylethyl) hydrogen phosphate

Method for direct bonding of metallic conductors to a ceramic substrate

Anisotropic electrically conductive structure

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE

Bonding method and bonding material using metal particle

Methods of connecting an antenna to a transponder chip

Method for integrating pre-fabricated chip structures into functional electronic systems

Circuit board structure having embedded semiconductor element and fabrication method thereof

Semiconductor chip and method of manufacturing semiconductor chip

Fabrication for electroplating thick metal pads

ELECTRONIC ASSEMBLY HAVING AN INDIUM WETTING LAYER ON A THERMALLY CONDUCTIVE BODY

SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DICE HAVING BACK SIDE REDISTRIBUTION LAYER ACCESSED USING THROUGH-SILICON VIAS, METHODS

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Flip chip mounting method by no-flow underfill

Flip chip mounting method by no-flow underfill having level control function

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Multilayer printed circuit board

Multilayer printed circuit board

Multilayer printed circuit board

Printed-wiring board, method of manufacturing printed-wiring board, and electronic equipment

System in package integrating a plurality of semiconductor chips

Voltage regulator integrated with semiconductor chip

Capillary-flow underfill compositions, packages containing same, and systems containing same

Semiconductor package and method of manufacturing the same

Mounting structure for semiconductor element

Semiconductor device and method of protecting passivation layer in a solder bump process

Integrated circuit package system with offset stacked die and method of manufacture thereof

Semiconductor device and manufacturing method of the same

METHOD FOR FABRICATING A CIRCUIT

Semiconductor device pad having the same voltage level as that of a semiconductor substrate

Mounting method for semiconductor parts on circuit substrate

Semiconductor device

Structure of dielectric layers in built-up layers of wafer level package

Microelectronic assemblies having compliancy and methods therefor

Stacked semiconductor chips having double adhesive insulating layer interposed therebetween

Method of Manufacturing a Semiconductor Packages and Packages Made

Memory device

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME

FLIP CHIP IN PACKAGE USING FLEXIBLE AND REMOVABLE LEADFRAME

Inverted lead frame in substrate

Power semiconductor component stack using lead technology with surface-mountable external contacts and a method for producing the same

Semiconductor device with lead frame including conductor plates arranged three-dimensionally

IC package encapsulating a chip under asymmetric single-side leads

Process for making contact with and housing integrated circuits

Image sensor and method for manufacturing the same

Semiconductor device

Nitride semiconductor device

Semiconductor device, method and apparatus for testing same, and method for manufacturing semiconductor device

Wiring structure of printed wiring board and method for manufacturing the same

Printed wiring board

Semiconductor Sensor Component Comprising Protected Feeders, and Method for the Production Thereof

Method of manufacturing multi-layer printed circuit board

Systems and methods to laminate passives onto substrate

Semiconductor device and electronic device

Electric component having microtips and ductile conducting bumps

Micro-machined structure production using encapsulation

Top layers of metal for high performance IC's

Chip structure and process for forming the same

Method for fabricating a circuit component

Method of manufacturing wafer level chip size package

Semiconductor package, manufacturing method thereof and IC chip

Manufacturing method for micro-SD flash memory card

Adhesive film composition, associated dicing die bonding film, and die package

Semiconductor apparatus and manufacturing method of semiconductor apparatus

Printed circuit board

Flip chip semiconductor packaging device and testing method using first and second reflectors for determining gap between chip and circuit board or first and second chips

Light source module, light source apparatus and liquid crystal display

Contact Pad And Bump Pad Arrangement for High-Lead Or Lead-Free Bumps

Thin passivation layer on 3D devices

Three-dimensional integrated circuits with protection layers

Semiconductor integrated circuit

DEVICE HAVING CONTACT PAD WITH A CONDUCTIVE LAYER AND A CONDUCTIVE PASSIVATION LAYER

Semiconductor processing methods, methods of forming contact pads, and methods of forming electrical connections between metal-containing layers

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Chip structure and process for forming the same

Chip structure and process for forming the same

Dummy patterns and method of manufacture for mechanical strength of low K dielectric materials in copper interconnect structures for semiconductor devices

Semiconductor device

Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same

Tubular-shaped bumps for integrated circuit devices and methods of fabrication

Three-dimensional package and method of making the same

Stress management in BGA packaging

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

WAFER LEVEL PACKAGE WITH GOOD CTE PERFORMANCE

3D ELECTRONIC PACKAGING STRUCTURE WITH ENHANCED GROUNDING PERFORMANCE AND EMBEDDED ANTENNA

TOOLS STRUCTURE FOR CHIP REDISTRIBUTION AND METHOD OF THE SAME

Leadframe on heat sink (LOHS) semiconductor packages and fabrication methods thereof

Semiconductor device package diepad having features formed by electroplating

Semiconductor device having active element formation region provided under a bump pad

Semiconductor device

Semiconductor device and method for manufacturing the same

GaOsemiconductor device

Printed circuit board

Post passivation interconnection schemes on top of the IC chips

Semiconductor chip and production process therefor

Method of sputtering a nickel silicon alloy, especially useful for forming a solder bump barrier

Manufacturing method of semiconductor device

Wafer bonding method of system in package

Die positioning for packaged integrated circuits

Semiconductor device and fabrication method thereof

Method of making semiconductor device

Liquid metal thermal interface material system

Semiconductor device

Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument

Semiconductor package and method of manufacturing the same

INTEGRATED CIRCUITS WITH CONDUCTIVE FEATURES IN THROUGH HOLES PASSING THROUGH OTHER CONDUCTIVE FEATURES AND THROUGH A SEMICONDUCTOR SUBSTRATE

Chip structure and process for forming the same

Method of bonding wire of semiconductor package

Structure and process for WL-CSP with metal cover

Semiconductor device

Method for manufacturing semiconductor device and semiconductor device

Solder Bump/Under Bump Metallurgy Structure for High Temperature Applications

Function element and function element mounting structure

Packaged integrated circuit with enhanced thermal dissipation

Semiconductor device

MULTI-CHIP PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

MULTI-CHIPS PACKAGE AND METHOD OF FORMING THE SAME

Wire bond interconnection

LDO regulator with ground connection through package bottom

Semiconductor device having plurality of leads

Electrical/optical integration scheme using direct copper bonding

Amplifier chip mounted on a lead frame

Articles and assembly for magnetically directed self assembly and methods of manufacture

Semiconductor wafer

Method for manufacturing an electrode and electrode component mounted body

Method for redirecting void diffusion away from vias in an integrated circuit design

Semiconductor device and manufacturing method of the same

Method of processing wafer

Optimum padset for wire bonding RF technologies with high-Q inductors

Packaged microelectronic devices and methods for packaging microelectronic devices

Electroplating method for a semiconductor device

Semiconductor chip package and method for fabricating the same

METHOD OF DIE STACKING USING INSULATED WIRE BONDS

Method of fabricating a film-on-wire bond semiconductor device

Single Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices

Double Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Resin-sealed electronic device and method of manufacturing the same

Semiconductor device and manufacturing method therefor

Semiconductor device including microstrip line and coplanar line

Semiconductor device and method of manufacturing the same

Microcircuit package having ductile layer

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing semiconductor device

Semiconductor module, method for manufacturing semiconductor modules and mobile device

Semiconductor chip and TAB package having the same

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Semiconductor chip package, printed circuit board assembly including the same and manufacturing methods thereof

System-in-package (SiP) and method of manufacturing the same

Semiconductor device having elastic solder bump to prevent disconnection

Stress decoupling structures for flip-chip assembly

Stacked die package

DIE STACKING USING INSULATED WIRE BONDS

FILM-ON-WIRE BOND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Semiconductor chip and method of producing the same

Solid-state imaging device

Semiconductor device and manufacturing method thereof

SEMICONDUCTOR INTEGRATED CIRCUIT AND FABRICATION METHOD FOR THE SAME

Semiconductor integrated circuit providing for wire bonding directly above an active circuit region, and manufacturing method thereof

Light emitting device having a mirror portion

Flip-chip mounting resin composition and bump forming resin composition

Component mounting apparatus and component mounting method

Chip structure and process for forming the same

Stacked structures and methods of fabricating stacked structures

Resin for sealing semiconductor device, resin-sealed semiconductor device and the method of manufacturing the semiconductor device

Reduction of damage to thermal interface material due to asymmetrical load

Electrical Insulating Layer for Metallic Thermal Interface Material

Adhesive composition, adhesive sheet and production process for semiconductor device

Gold/silicon eutectic die bonding method

Method of mounting semiconductor chip to circuit substrate using solder bumps and dummy bumps

Mounting method of semiconductor element using outside connection projection electyrode and manufacturing method of semiconductor device using outside connection projection electrode

MULTI-COMPONENT ELECTRONIC PACKAGE WITH PLANARIZED EMBEDDED-COMPONENTS SUBSTRATE

METHOD AND APPARATUS FOR CREATING RFID DEVICES USING MASKING TECHNIQUES

Silica nanoparticles thermoset resin compositions

Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud-bumps

METHOD OF FORMING METAL LAYER WIRING STRUCTURE ON BACKSIDE OF WAFER, METAL LAYER WIRING STRUCTURE FORMED USING THE METHOD, METHOD OF STACKING CHIP PACKAGE, AND CHIP PACKAGE STACK STRUCTURE FORMED USING THE METHOD

Three-dimensional wafer stacking with vertical interconnects

Bonding structures and methods of forming bonding structures

Rotation joint and semiconductor device having the same

Chip structure and process for forming the same

Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apart

Semiconductor device with no base member and method of manufacturing the same

Solder bump structure and method of manufacturing same

Semiconductor device and a method of manufacturing the same

Flip-chip assembly and method of manufacturing the same

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE CONTAINING THE SAME

Method of fabricating electronic device having sacrificial anode, and electronic device fabricated by the same

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

Systems and methods to passivate on-die redistribution interconnects

Semiconductor module with at least two substrates

HEAT SPREADER FOR AN ELECTRICAL DEVICE

Semiconductor device

Semiconductor device

SEMICONDUCTOR CHIP EMBEDDED IN AN INSULATOR AND HAVING TWO-WAY HEAT EXTRACTION

SEMICONDUCTOR DEVICE INCLUDING CORROSION RESISTANT WIRING STRUCTURE

Module comprising polymer-containing electrical connecting element

Semiconductor Device And Production Method For Semiconductor Device

Method for producing a semiconductor device including connecting a functional wafer to a carrier substrate and selectively etching the carrier substrate

Top layers of metal for integrated circuits

Semiconductor chips for TAG applications, devices for mounting the same, and mounting method

Interconnect For Microelectronic Structures With Enhanced Spring Characteristics

Cushion and method for manufacturing the same

Manufacturing method of electronic board and multilayer wiring board

SEMICONDUCTOR CHIP HAVING BUMPS OF DIFFERENT HEIGHTS AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Method for manufacturing semiconductor device with reduced damage to metal wiring layer

Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same

Method for manufacturing semiconductor device

Wire and solder bond forming methods

Wire and solder bond forming methods

WAFER SCALE THIN FILM PACKAGE

Method of packaging a device using a dielectric layer

METHOD AND STRUCTURE OF PATTERN MASK FOR DRY ETCHING

Printed circuit board and fabricating method thereof

Lithographic apparatus and method

Semiconductor device and method for manufacturing same

Assembly and Method of Placing the Assembly on an External Board

Self-aligned through vias for chip stacking

Post passivation interconnection schemes on top of the IC chips

Method of packaging a device having a multi-contact elastomer connector contact area and device thereof

Embedded chip package with improved heat dissipation performance and method of making the same

Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate

Circuit board structure with embedded semiconductor chip and method for fabricating the same

Wafer level package with die receiving cavity and method of the same

Method of packaging a device having a tangible element and device thereof

Semiconductor device, stacked semiconductor device and interposer substrate

Wirebond Package Design for High Speed Data Rates

WIRE BOND AND METHOD OF FORMING SAME

Packaged semiconductor chips

CHIP-PACKAGING COMPOSITIONS INCLUDING CATALYSTS AND HARDENERS, PACKAGES MADE THEREWITH, AND METHODS OF ASSEMBLING SAME

METHOD AND STRUCTURE OF PATTERN MASK FOR DRY ETCHING

System and method for solder bump plating

Method of making lithographic contact elements

Method of manufacturing a component-embedded printed circuit board

LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE

Low fabrication cost, high performance, high reliability chip scale package

Film and chip packaging process using the same

Method for manufacturing electronic component, and electronic component

Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components

Module with carrier element

Semiconductor integrated circuit and multi-chip module

Low loop height ball bonding method and apparatus

Structure and method for enhancing resistance to fracture of bonding pads

COPPER-METALLIZED INTEGRATED CIRCUITS HAVING AN OVERCOAT FOR PROTECTING BONDABLE METAL CONTACTS AND IMPROVING MOLD COMPOUND ADHESION

High performance system-on-chip using post passivation process

Integrated circuit chips with fine-line metal and over-passivation metal

Low fabrication cost, high performance, high reliability chip scale package

Semiconductor package with embedded die

WIRING FILM HAVING WIRE, SEMICONDUCTOR PACKAGE INCLUDING THE WIRING FILM, AND METHOD OF FABRICATING THE SEMICONDUCTOR PACKAGE

Semiconductor package

Radiation hardened lateral MOSFET structure

PACKAGE DESIGNS FOR VERTICAL CONDUCTION DIE

Component-embedded circuit board fabrication method

Method of sealing or welding two elements to one another

METHOD FOR ATTACHING INTEGRATED CIRCUIT COMPONENT TO A SUBSTRATE

Wiring board and method of manufacturing the same

Circuit device and method of manufacturing the same

Electrical component having external contacting

SEMICONDUCTOR DEVICE HAVING INTERPOSER FORMED ON CHIP

SEMICONDUCTOR CHIP STACK PACKAGE WITH REINFORCING MEMBER FOR PREVENTING PACKAGE WARPAGE CONNECTED TO SUBSTRATE

Semiconductor device having projecting electrode formed by electrolytic plating, and manufacturing method thereof

Metal filled through via structure for providing vertical wafer-to-wafer interconnection

Gold wire for connecting semiconductor chip

Semiconductor device and manufacturing method of the same

Fan out type wafer level package structure and method of the same

Semiconductor module including components in plastic casing

Integrated Circuit Package and Method for Manufacturing an Integrated Circuit Package

Thin, thermally enhanced flip chip in a leaded molded package

Semiconductor device, wiring of semiconductor device, and method of forming wiring

Sensor-type semiconductor package and fabrication

Semiconductor chip, semiconductor device and methods for producing the same

Power semiconductor module

Plating Device, Plating Method, Semiconductor Device, And Method For Manufacturing Semiconductor Device

Electronic component and wire bonding method

Method for manufacturing electronic substrate

Solder ball mounting method and solder ball mounting substrate manufacturing method

Non-pull back pad package with an additional solder standoff

Method of manufacturing complementary metal oxide semiconductor image sensor

Wire-bonding method for wire-bonding apparatus

Base plate for a power semiconductor module

Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices

Low fabrication cost, high performance, high reliability chip scale package

Semiconductor device

Packaged microelectronic devices and methods for packaging microelectronic devices

Semiconductor device and a method of manufacturing the same

Semiconductor device, mounting structure, electro-optical apparatus, electronic system, and method for manufacturing electronic component

Flip-Chip Semiconductor Package with Encapsulant Retaining Structure and Strip

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

Embedded chip package

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

Stacked chip package structure with leadframe having inner leads with transfer pad

Semiconductor package and method of forming wire loop of semiconductor package

Semiconductor device and a method of manufacturing the same

CONNECTING A PLURALITY OF BOND PADS AND/OR INNER LEADS WITH A SINGLE BOND WIRE

Stacked chip packaging with heat sink structure

Semiconductor device, method of manufacturing the same

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME