Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particles

Electronic device substrate and its fabrication method, and electronic device and its fabrication method

Ball assignment system

Method of manufacturing enhanced thermal dissipation integrated circuit package

Method of manufacturing flexible circuit substrate

Method for forming laminated structure and method for manufacturing semiconductor device using the method thereof

SEMICONDUCTOR PACKAGE SUBSTRATE HAVING CONTACT PAD PROTECTIVE LAYER FORMED THEREON AND METHOD FOR FABRICATING THE SAME

Ball grid array package and process for manufacturing same

Organic substrates with integral thin-film capacitors, methods of making same, and systems containing same

Method of production of circuit board utilizing electroplating

Optical device module, optical path fixing device, and method for manufacturing optical device module

Semiconductor device and an image sensing device

Multi-chip semiconductor device with high withstand voltage, and a fabrication method of the same

Semiconductor device to be applied to various types of semiconductor package

Stacked die package

Chip package with dam bar restricting flow of underfill

Multi-chip package and method for manufacturing the same

Method of mounting an integrated circuit package in an encapsulant cavity

Bump land structure of circuit substrate for semiconductor package

ELECTRONIC DEVICE PACKAGE

Semiconductor device and method of manufacturing thereof

Integrated heat spreader with intermetallic layer and method for making

Semiconductor packages and methods of manufacturing thereof

Thermally enhanced three-dimensional package and method for manufacturing the same

Semiconductor device and a manufacturing method of the same

Electronic device and method for fabricating the same

Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance

Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides

Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides

Stacked-type semiconductor device and method of manufacturing the same

Stacked semiconductor package

Vertically integrated system-in-a-package

Semiconductor device and method of manufacturing the same

Wafer level package including a device wafer integrated with a passive component

Distortion and shock resistant optical device module for image capture

Image sensor module with optical path delimiter and accurate alignment

Multilayer wiring board and its manufacturing method

Device for controlling a vehicle

Method of manufacturing a semiconductor device

Stacked die-in-die BGA package with die having a recess

Manufacturing method of wiring substrate

Vertically stacked semiconductor device

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Integrated circuit carrier

Semiconductor structure with RF element

Secure system for tracking elements using tags

Method for fabricating flip-attached and underfilled semiconductor devices

Method for designing chip package by re-using existing mask designs

Semiconductor chip and method manufacturing the same

Electronic assembly including multiple substrates

Semiconductor device having a functional surface

Semiconductor device having a frame portion and an opening portion with mountable semiconductor chips therein

Semiconductor packaging mold and method of manufacturing semiconductor package using the same

Stress absorption layer and cylinder solder joint method and apparatus

Shield and semiconductor die assembly

Semiconductor device including substrate and upper plate having reduced warpage

Power semiconductor devices and methods of manufacture

Power semiconductor devices and methods of manufacture

System for tracking elements using tags

Flip-chip adaptor package for bare die

Semiconductor device and manufacturing method of the same

Semiconductor integrated circuit arrangement device and method

Method of producing a package for semiconductor chips

Electronic function part mounted body and method of manufacturing the electronic function part mounted body

Semiconductor device

Power amplifier circuitry having inductive networks

Microelectronic component assemblies with recessed wire bonds and methods of making same

Stacked package integrated circuit

Wiring board and method of manufacturing the same

Strain silicon wafer with a crystal orientation (100) in flip chip BGA package

Stacked semiconductor package

Holder for electronic component, holding sheet for electronic component, electronic module using holder, electronic module using holding sheet, lamination of electronic modules, method for manufacturing electronic module, and method for testing electronic module

Wiring board manufacturing method

METHOD FOR LAMINATING CHIPS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

Method for manufacturing a semiconductor package with a laminated chip cavity

Solder masks used in encapsulation, assemblies including the solar mask, and methods

Semiconductor device and method of manufacturing the same

Semiconductor device

Semiconductor device having a package base with at least one through electrode

Printed wiring board and method for manufacturing the same

Tape ball grid array package with electromagnetic interference protection and method for fabricating the package

Chip package and fabricating method thereof

Heat spreader and package structure utilizing the same

Interposer, and multilayer printed wiring board

Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads

Method for MCP packaging for balanced performance

Semiconductor component having stiffener, circuit decal and terminal contacts

FINE PAD PITCH ORGANIC CIRCUIT BOARD WITH PLATING SOLDER AND METHOD FOR FABRICATING THE SAME

Stacked microfeature devices

Semiconductor integrated circuit and semiconductor device

Semiconductor device and a manufacturing method of the same

Method for reducing assembly-induced stress in a semiconductor die

Signal transmission circuit, IC package, and mounting board

Semiconductor device including a semiconductor chip with signal contact areas and supply contact areas, and method for producing the semiconductor device

Semiconductor device

System for different bond pads in an integrated circuit package

Integrated circuit having memory and router disposed thereon and method of making thereof

Semiconductor device having a plastic housing and external connections and method for producing the same

HEAT SINK AND PACKAGE STRUCTURE

Semiconductor device and method of stacking semiconductor chips

Stacked integrated circuits package system with dense routability and high thermal conductivity

Stacked device package for peripheral and center device pad layout device

Semiconductor device

Semiconductor package with passive device integration

Semiconductor device, magnetic sensor, and magnetic sensor unit

METALLIC PLATING FOR SOCKET APPLICATION IN BALL GRID ARRAY PACKAGES

Semiconductor memory device and stress testing method thereof

Methods for assembling semiconductor devices and interposers

MULTI-CHIP BALL GRID ARRAY PACKAGE

Circuit device and manufacturing method thereof

Thin multi-terminal capacitor and method of manufacturing the same

Electronic device, standoff member, and method of manufacturing electronic device

Semiconductor chip package and method of manufacture

Interconnecting substrate and semiconductor device

Semiconductor device

Chip stack employing a flex circuit

Encapsulation method for semiconductor device having center pad

Method and resistive bridge circuit for the detection of solder-joint failures in a digital electronic package

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

Patch substrate for external connection

Semiconductor device package, method of manufacturing the same, and semiconductor device

Semiconductor device having a through contact through a housing composition and method for producing the same

Thin silicon based substrate

Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment

Semiconductor component and method of manufacture

Microfeature systems including adhered microfeature workpieces and support members

Integrated circuit package-in-package system

Method of manufacturing semiconductor device

Multi-chip module and method for mounting thereof

Semiconductor device

Semiconductor device and manufacturing method thereof

Substrate assembly with direct electrical connection as a semiconductor package

Package structure with chip embedded in substrate

Semiconductor device and its writing method

Electronic component with stacked semiconductor chips and method for producing the same

Semiconductor device

Semiconductor packages and methods for making and using same

Heat sink, an electronic component package, and a method of manufacturing a heat sink

Semiconductor device with micro connecting elements and method for producing the same

Thermally coupled surfaces having controlled minimum clearance

Method for producing an electronic component with shielding

Flip chip ball grid array package with constraint plate

Semiconductor device

Semiconductor device

Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same

Substrate for an FBGA semiconductor component

Apparatus and methods for cooling semiconductor integrated circuit chip packages

Fine pitch low cost flip chip substrate

Ground arch for wirebond ball grid arrays

Stacked die package system

Stacked integrated circuit and package system

Semiconductor package with low and high-speed signal paths

Semiconductor storage device, semiconductor device, and manufacturing method therefor

Magnetic shielding for magnetically sensitive semiconductor devices

Perimeter matrix ball grid array circuit package with a populated center

Circuitized substrate utilizing three smooth-sided conductive layers as part thereof and electrical assemblies and information handling systems utilizing same

Multilayer substrate and method for producing same

Methods of adhering microfeature workpieces, including a chip, to a support member

Method for fabricating semiconductor packages with semiconductor chips

Interposer for decoupling integrated circuits on a circuit board

Semiconductor device including capsule type semiconductor package and semiconductor chip in stacking manner

Consolidated flip chip BGA assembly process and apparatus

Ball grid array package

Interposers with flexible solder pad elements

Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof

Nested integrated circuit package on package system

Integrated circuit package system using interposer

Stacked structure of integrated circuits and method for manufacturing the same

Substrate structure with embedded semiconductor chip and fabrication method thereof

Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methods

Wiring board and capacitor to be built into wiring board

Method of embedding semiconductor element in carrier and embedded structure thereof

Method for making a semiconductor multi-package module having wire bond interconnect between stacked packages

Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package

Method of fabricating a semiconductor stacked multi-package module having inverted second package

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Method of fabricating a semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA)

Chip-stacked semiconductor package and method for fabricating the same

Chip scale image sensor module and fabrication method of same

Semiconductor device

Semiconductor device and method of manufacturing thereof

Through-substrate interconnect structures and assemblies

Module structure having embedded chips

Semiconductor package integral heat spreader

Flip chip interconnection pad layout

Semiconductor package system with cavity substrate

Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages

Stacked type semiconductor device and method of fabricating stacked type semiconductor device

Electronic device and method for fabricating the same

Semiconductor device

Semiconductor device and method of manufacturing the same

Chip packaging structure adapted to reduce electromagnetic interference

Printed wiring board having a solder pad and a method for manufacturing the same

Semiconductor manufacturing method for die bonding

Forming buried via hole substrates

Method of making a semiconductor chip assembly using multiple etch steps to form a pillar after forming a routing line

Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices

Integrated circuit die connection methods and apparatus

Thermal enhanced package for block mold assembly

Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment

Semiconductor device

Semiconductor mounting board

Structure and manufacturing method of a chip scale package

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device

Semiconductor chip electrical connection structure

Flip chip interconnection pad layout

Semiconductor device

Semiconductor device and manufacturing method thereof

Chip on board leadframe for semiconductor components having area array

Electronic circuit board

Connection substrate, multi-layer wiring board using the connection substrate, substrate for semiconductor package, and methods for manufacturing them

Economical high-frequency package

Method of manufacturing semiconductor device and method of treating electrical connection section

Interconnection structure through passive component

Heat sink for surface-mounted semiconductor devices

Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof

Method for making a semiconductor multi-package module having inverted bump chip carrier second package

Flip-chip package structure with direct electrical connection of semiconductor chip

Circuit board and manufacturing method therefor and semiconductor package and manufacturing method therefor

Electronic device package and method of manufacturing the same

Structure for joining a semiconductor package to a substrate using a solder column

Stacked semiconductor package having interposing print circuit board

Low profile ball-grid array package for high power

Laminated thin film capacitor and semiconductor apparatus

Reader / writer and method for manufacturing the same

Solder ball loading method and solder ball loading unit background of the invention

Microvia structure and fabrication

Cooling structure of solid state and formation thereof with integrated package

Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate

Integrated packaged having magnetic components

Semiconductor device having a particular electrode structure

Semiconductor device, wiring substrate, and method for manufacturing wiring substrate

Method for making a semiconductor multipackage module including a processor and memory package assemblies

Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate

Semiconductor device and manufacturing method therefor

Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate

Patterned plasma treatment to improve distribution of underfill material

Electronic component package including heat spreading member

Semiconductor device having signal line and reference potential planes separated by a vertical gap

Semiconductor package and fabrication method of the same

Electronic device

BGA package substrate and method of fabricating same

Semiconductor device with improved arrangement of a through-hole in a wiring substrate

BGA package having half-etched bonding pad and cut plating line and method of fabricating same

Semiconductor devices having post passivation interconnections and a buffer layer

Multilayer board and a semiconductor device

Three dimensional package structure with semiconductor chip embedded in substrate and method for fabricating the same

Microelectronic multi-chip module

Multi-chip package mounted memory card

Circuit device and portable device with symmetrical arrangement

Semiconductor package having enhanced heat dissipation and method of fabricating the same

Electro-optic integrated circuits with connectors and methods for the production thereof

Printed circuit board structure for mobile terminal

Adhesive of folder package

Method of manufacturing a semiconductor device

Semiconductor package having semiconductor constructing body and method of manufacturing the same

Method for making semiconductor multi-package module having inverted second package and including additional die or package stacked on second package

Packaging for electronic modules

Stacked electronic component and manufacturing method thereof

Semiconductor device with mechanism for leak defect detection

Intelligent high-power amplifier module

Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors

Method for fabricating thermally enhanced semiconductor package

Integrated circuit packaging device and method for matching impedance

Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package

Semiconductor package module without a solder ball and method of manufacturing the semiconductor package module

Microelectronic package having stacked semiconductor devices and a process for its fabrication

High power light emitting diode device

One step capillary underfill integration for semiconductor packages

Substrate for semiconductor devices and semiconductor device

Device for electrical connection of an integrated circuit chip

Multi-chip package structure

Microelectronic packages using a ceramic substrate having a window and a conductive surface region

One step capillary underfill integration for semiconductor packages

Resin-encapsulated package, lead member for the same and method of fabricating the lead member

IC substrate with over voltage protection function

IC substrate with over voltage protection function

Ball grid array IC substrate with over voltage protection function

IC substrate with over voltage protection function

IC substrate with over voltage protection function

Power core devices

Image sensor package, solid state imaging device, and fabrication methods thereof

Semiconductor device and manufacturing method therefor

Packaged semiconductor die and manufacturing method thereof

Methods of forming semiconductor packages

Semiconductor package with a controlled impedance bus

Module

Carrier with metal bumps for semiconductor die packages

Multi-level semiconductor module and method for fabricating the same

Semiconductor chip having coolant path, semiconductor package and package cooling system using the same

Hyper thermally enhanced semiconductor package system comprising heat slugs on opposite surfaces of a semiconductor chip

Ball grid array substrate having window and method of fabricating same

Semiconductor device with a substrate having a spiral shaped coil

Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Multi-chip package structure

Multi-chip package structure

Multi-level semiconductor module

Multi-layer printed circuit board comprising a through connection for high frequency applications