Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof

Integrated magnetic flux concentrator

Illumination system comprising a radiation source and a fluorescent material

Magnetic assist manufacturing to reduce mold flash and assist with heat slug assembly

Semiconductor device including wire bonding pads and pad layout method

Wafer level pre-packaged flip chip system

Packaging structure and method

Flip chip interconnect solder mask

Flip chip package having protective cap and method of fabricating the same

Semiconductor device chip and semiconductor device chip package

Integrated circuit package device comprising electrical contacts making solderless and bondless electrical-mechanical connection

Handling and positioning of metallic plated balls for socket application in ball grid array packages

Multi-chip electronic package with reduced line skew and circuitized substrate for use therein

Stacked semiconductor memory device

Semiconductor module provided with contacts extending through the package

Lid used in package structure and the package structure having the same

Stacked modules and method

System and method for vertically stacking computer memory components

Multi stack packaging chip and method of manufacturing the same

Apparatus and methods for constructing balanced chip packages to reduce thermally induced mechanical strain

Lead frame and resin-encapsulated semiconductor device

Lead-free semiconductor device

Semiconductor device with sealed semiconductor chip

Method for encapsulating a semiconductor device and semiconductor device

Shielding noisy conductors in integrated passive devices

Front side illuminated photodiode with backside bump

Methods of packaging and testing microelectronic imaging devices

Semiconductor device and manufacturing method of the same

Semiconductor component in a housing with mechanically inforcing flat conductor webs

Light emitting element mounting frame and light emitting device

Radiation emitting semiconductor component with luminescent conversion element

Electrode structure, and semiconductor light-emitting device having the same

Photodiode array, method for manufacturing same, and radiation detector

Method for packaging an image sensor die and a package thereof

Memory card, the fabrication thereof and a mobile phone apparatus having a memory card

Technique for defining a wettable solder joint area for an electronic assembly substrate

Wire loop, semiconductor device having same and wire bonding method

Camera-assisted adjustment of bonding head elements

Method for making a flat-top pad

Method of manufacturing a device having a contacting structure

Solder ball pad surface finish structure of circuit board and fabrication method thereof

CMOS image sensor module with wafers

Circuit device and method of manufacturing thereof

Intermediate semiconductor device structures

Semiconductor device and method for the fabrication thereof including grinding a major portion of the frame

Method and apparatus for creating RFID devices

Method of forming a stack of packaged memory dice

Method of fabricating wafer level package

Method for manufacturing photoelectric package having control chip

Transparent member, optical device using transparent member and method of manufacturing optical device

Silicon optical package with 45 degree turning mirror

Method and apparatus for electronically aligning capacitively coupled mini-bars

Surface protection film and method for producing the same

Au alloy bonding wire

Semiconductor laser apparatus and optical pickup apparatus

System component interposer

Layer capacitor element and production process as well as electronic device

Vehicle-mounted millimeter wave radar device, millimeter wave radar module, and manufacturing method thereof

Signal isolators using micro-transformers

Bond pad structure comprising multiple bond pads with metal overlap

White-light light emitting diode device

Metrology system and method for stacked wafer alignment

Microelectronic packages and methods therefor

Bumpless semiconductor device

Method and apparatus for soldering modules to substrates

Flip-chip semiconductor device

Multiple chip package module including die stacked over encapsulated package

Terminal pad structures and methods of fabricating same

Substrate with adhesive bonding metallization with diffusion barrier

Semiconductor device with passivation layer covering wiring layer

Contact structure on chip and package thereof

Method of making the semiconductor device, circuit board, and electronic instrument

Semiconductor device and fabrication method thereof

Chip-scale package

Package for receiving electronic parts, and electronic device and mounting structure thereof

Method for fabricating structure of polymer-matrix conductive film

Semiconductor device with substrate having penetrating hole having a protrusion

Wirebonded device packages for semiconductor devices having elongated electrodes

Large die package and method for the fabrication thereof

Stacked package semiconductor module having packages stacked in a cavity in the module substrate

Method and apparatus for forming stacked die and substrate structures for increased packing density

Multi-chip module having a support structure and method of manufacture

Stack type surface acoustic wave package, and method for manufacturing the same

SEMICONDUCTOR PACKAGE HAVING ULTRA-THIN THICKNESS AND METHOD OF MANUFACTURING THE SAME

Bondwire utilized for coulomb counting and safety circuits

Light emitting device

Semiconductor light-emitting device and method for manufacturing the device

Multi-wavelength white light emitting diode

Solid-state imaging device and manufacturing method thereof

Manufacturing method for photoelectric package structure having two-layered substrate and control chip

Spot heat wirebonding

Manufacturing method of solid-state image sensing device

Conductive bump structure for semiconductor device and fabrication method thereof

Methods of forming wire bonds for semiconductor constructions

Multi-chip module and method of manufacture

Post bump passivation for soft error protection

Flip chip method

Multiple etch-stop layer deposition scheme and materials

Alignment key structure in a semiconductor device and method of forming the same

Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment

Semiconductor package with controlled solder bump wetting and fabrication method therefor

Chipcard with contact areas and method for producing contact areas

Technique for enhancing thermal and mechanical characteristics of an underfill material of a substrate/die assembly

Methods for applying front side and edge protection material to electronic devices at the wafer level, devices made by the methods, and systems including the devices

Semiconductor device with semiconductor chip and rewiring layer and method for producing the same

Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same

Stacked die package for peripheral and center device pad layout device

Fabrication method of light emitting diode package

Structure of laser diode and method of manufacturing the same

Method of manufacturing vertical cavity surface emitting laser

Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions

Semiconductor device

Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices

Three dimensional packaging optimized for high frequency circuitry

Semiconductor power module package

Light emitting device package

Semiconductor light emitting device

Package substrate with built-in capacitor and manufacturing method thereof

Methods for providing bias to a monolithic microwave integrated circuit

Differential amplifier circuitry formed on semiconductor substrate with rewiring technique

Power switching control device for electric systems

Compliant contact pin test assembly and methods thereof

Device and method for testing integrated circuit dice in an integrated circuit module

Method of fabricating a stacked integrated circuit package system

Bond pad structures and semiconductor devices using the same

Conductive ball mounting apparatus

Wire bonded semiconductor device having low inductance and noise

Memory packages having stair step interconnection layers

Semiconductor device production method and semiconductor device

Solder deposition on wafer backside for thin-die thermal interface material

Electronic component and electronic configuration

Conductive bump structure of circuit board and method for forming the same

Solder bumps in flip-chip technologies

Techniques for improving bond pad performance

Microelectronic component and assembly having leads with offset portions

Multilayer printed wiring board

Dicing die adhesive film for semiconductor

Method of manufacturing a semiconductor apparatus

Multi-chip semiconductor package

Semiconductor device and method of manufacturing the same

Electronic circuit device

Semiconductor device with a rewiring level and method for producing the same

Circuit board with built-in electronic component and method for manufacturing the same

High power radiation emitter device and heat dissipating package for electronic components

Semiconductor device having a flexible board for connection to a semiconductor chip mounted on an insulating substrate

Chip package structure and method for manufacturing the same

Systems, methods, and apparatus for connecting a set of contacts on an integrated circuit to a flex circuit via a contact beam

Electronic device

Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions

Integrated circuit device including a bifunctional core material in a chamber

Surface-mountable light-emitting diode light source and method of producing a light-emitting diode light source

LED package structure and method of packaging the same

High heat dissipating LED having a porous material layer

Semiconductor light emitting device

WHITE LIGHT EMITTING DIODE DEVICE

Surface mount type photo interrupter and method for manufacturing the same

RGB thermal isolation substrate

Structure of polymer-matrix conductive film and method for fabricating the same

Microelectronic package interconnect and method of fabrication thereof

Packaging structure of a light-sensing element and fabrication method thereof

Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers

Semiconductor device assemblies with compliant spring contact structures

Methods and apparatus for interconnecting a ball grid array to a printed circuit board

Multilayer printed wiring board

Forming folded-stack packaged device using progressive folding tool

Forming folded-stack packaged device using progressive folding tool

Method of forming folded-stack packaged device using progressive folding tool

Forming folded-stack packaged device using progressive folding tool

Thermoelectric generators for solar conversion and related systems and methods

Gap-filling in electronic assemblies including a TEC structure

Pressure detecting apparatus

Angular velocity sensor

Fabrication of compliant spring contact structures and use thereof

Method of making a circuitized substrate

Gap control between interposer and substrate in electronic assemblies

Semiconductor device and method of manufacturing the same

Method of manufacturing a semiconductor device

Semiconductor device with terminals, and method of manufacturing the same

Method of making a multi-chip electronic package having laminate carrier

Integrated circuit package and method for producing it

Package-integrated thin film LED

Optical module and method for manufacturing same

Chip carrier apparatus and method

Laser apparatus and method for assembling the same

Optical transmit assembly including thermally isolated laser, temperature sensor, and temperature driver

Optical pickup and optical storage device

Method for manufacture of transparent devices having light emitting diodes (LED)

Projector-type lamp unit for vehicle

Vehicle headlamp

Display device with molded light guide

Apparatus for attaching a cooling structure to an integrated circuit

Circuit device

Regulator

Active primary-sided circuit arrangement for a switch-mode power supply

Encapsulating method for image sensing element

Transparent LED display

Transparent LED display and method for manufacture thereof

Rotation detecting device using magnetic sensor

Piezoelectric oscillator, manufacturing method thereof, and electronic device

Substrate for producing a soldering connection to a second substrate

Semiconductor die edge reconditioning

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

BGA-type multilayer circuit wiring board

Semiconductor device and method for producing the same

Semiconductor package

Apparatus for conducting heat in a flip-chip assembly

Microelectronic assemblies having compliant layers

Electronic circuit device

System having semiconductor component with multiple stacked dice

Standoffs for centralizing internals in packaging process

Semiconductor device and electronic device

Semiconductor device with electrically isolated ground structures

Device packages having a III-nitride based power semiconductor device

Lead frame for semiconductor package and method of manufacturing the same

Shielding arrangement to protect a circuit from stray magnetic fields

Semiconductor substrate

Semiconductor device having surface mountable external contact areas and method for producing the same

Light-emitting diode and method for improving emitting directivity of light-emitting chip

Light-emitting device

Smart card comprising a protruding component and method for making same

Substrate for mounting electronic part and electronic part

Multilayer printed wiring board

Cleaning method for semiconductor elements

Method of surface treatment of group III nitride crystal film, group III nitride crystal substrate, group III nitride crystal substrate with epitaxial layer, and semiconductor device

Die attach adhesives with improved stress performance

Electronic apparatus and method for manufacturing the same

Bumping process and bump structure

Method of forming low stress multi-layer metallurgical structures and high reliable lead free solder termination electrodes

Semiconductor chip having a soldering layer sequence, and process for soldering a semiconductor chip

Electronic component and method for its production

Thin passivation layer on 3D devices

Leadframe with encapsulant guide and method for the fabrication thereof

System for providing a redistribution metal layer in an integrated circuit

Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers

Method of forming a substrateless semiconductor package

Electronic device

Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture

Semiconductor device with self-aligning contactless interface

Production method of a multilayer ceramic substrate

Multi-layer ceramic substrate, method for manufacturing the same and electronic device using the same

Optical module

Optical pickup and optical storage device

Illumination device having luminous spots formed by light emitting diodes

Light unit display

Electric circuit module with improved heat dissipation characteristics using a fixing tool for fixing an electric apparatus to a heat sink

Coolant cooled type semiconductor device

Light emitting device

Semiconductor device and manufacturing method thereof

Blue to yellow-orange emitting phosphor, and light source having such a phosphor

Ballast for light emitting device

Non-cavity semiconductor packages

Bonding pad for a packaged integrated circuit

Structure for mounting semiconductor part in which bump and land portion are hardly detached from each other and method of manufacturing mounting substrate used therein

BGA semiconductor chip package and mounting structure thereof

Electronic devices including offset conductive bumps

Semiconductor package accomplishing fan-out structure through wire bonding

Semiconductor module and method of forming a semiconductor module

Integrated circuit system for bonding

Thermally enhanced semiconductor package and fabrication method thereof

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

Semiconductor device

Pillar grid array package

High density direct connect LOC assembly

Multilevel semiconductor module and method for fabricating the same

Thin multiple semiconductor die package

Semiconductor device having resin-sealed area on circuit board thereof

Semiconductor device

ELECTRICAL PACKAGE STRUCTURE INCLUDING CHIP WITH POLYMER THEREON

Lead frame for semiconductor package

Semiconductor device and chip-stack semiconductor device

Semiconductor chip mounting body and manufacturing method thereof

Semiconductor wafer, semiconductor chip and dicing method of a semiconductor wafer

Manufacturing process of a chip package structure

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

Red phosphor for LED based lighting

Light emitting diode package for enhancing light extraction

Multiple-wavelength light emitting diode and its light emitting chip structure

Semiconductor device including ROM interface pad

Fluorescent substance, method of manufacturing fluorescent substance, and light emitting device using the fluorescent substance

Image sensor module package

Ultrasonic tool and ultrasonic bonder

Heater that attaches electronic component to and detaches the same from substrate

Method for manufacturing semiconductor device

Multilayer printed wiring board

Conductive ball mounting apparatus

LED Light Strings

Capacitor with co-planar electrodes

Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein

Chip-embedded support-frame board wrapped by folded flexible circuit for multiplying packing density

Method for fabricating a flip chip package

Method for fabricating semiconductor components with through wire interconnects

Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulating

Nonadjustable focusing type camera module

Fiber optic transceiver module having built-in test capability and associated method

Semiconductor laser apparatus, method of manufacturing semiconductor laser apparatus, and optical pickup apparatus

Light emitting panel

Micro electric power converter

Cooling apparatus for electronic device

Integrated heat spreader and method for using